74LVC16827APAG IDT, Integrated Device Technology Inc
Hersteller: IDT, Integrated Device Technology Inc
Description: IC BUFF NON-INVERT 3.6V 56TSSOP
Supplier Device Package: 56-TSSOP
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 10
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Packaging: Bulk
| Anzahl | Preis |
|---|---|
| 159+ | 3.16 EUR |
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Technische Details 74LVC16827APAG IDT, Integrated Device Technology Inc
Description: IC BUFF NON-INVERT 3.6V 56TSSOP, Supplier Device Package: 56-TSSOP, Current - Output High, Low: 24mA, 24mA, Number of Bits per Element: 10, Voltage - Supply: 2.7V ~ 3.6V, Operating Temperature: -40°C ~ 85°C (TA), Logic Type: Buffer, Non-Inverting, Number of Elements: 2, Mounting Type: Surface Mount, Output Type: 3-State, Package / Case: 56-TFSOP (0.240", 6.10mm Width), Packaging: Bulk.
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74LVC16827APAG | Hersteller : Renesas Electronics America Inc |
Description: IC BUF NON-INVERT 3.6V 56TSSOP Supplier Device Package: 56-TSSOP Current - Output High, Low: 24mA, 24mA Number of Bits per Element: 10 Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 56-TFSOP (0.240", 6.10mm Width) Packaging: Tube |
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74LVC16827APAG | Hersteller : Renesas Electronics |
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