80-PGM12015-10 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET PGA GOLD
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Termination: Solder
Operating Temperature: -55°C ~ 105°C
Type: PGA
Mounting Type: Through Hole
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
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Technische Details 80-PGM12015-10 Aries Electronics
Description: CONN SOCKET PGA GOLD, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Termination: Solder, Operating Temperature: -55°C ~ 105°C, Type: PGA, Mounting Type: Through Hole, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm).
Weitere Produktangebote 80-PGM12015-10
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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80-PGM12015-10 | Hersteller : Aries Electronics |
IC & Component Sockets |
Produkt ist nicht verfügbar |