806-22-001-30-010191 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONTACT SPRING LOADED SMD GOLD
Features: Pick and Place
Packaging: Tape & Reel (TR)
Contact Finish: Gold
Current Rating (Amps): 2A
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.217" (5.51mm)
Pad Layout Dimension: Circular - 0.072" (1.83mm)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25gf
Operating Force - Mid Compression: 60gf
Produktrezensionen
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Technische Details 806-22-001-30-010191 Mill-Max Manufacturing Corp.
Description: CONTACT SPRING LOADED SMD GOLD, Features: Pick and Place, Packaging: Tape & Reel (TR), Contact Finish: Gold, Current Rating (Amps): 2A, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Copper Alloy, Mating Cycles: 1000000, Part Status: Active, Maximum Working Height: 0.217" (5.51mm), Pad Layout Dimension: Circular - 0.072" (1.83mm), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25gf, Operating Force - Mid Compression: 60gf.
Weitere Produktangebote 806-22-001-30-010191 nach Preis ab 1.11 EUR bis 2.07 EUR
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806-22-001-30-010191 | Mill-Max |
Circuit Board Hardware - PCB SMT SpringPin RmvblCap H.217 |
auf Bestellung 745 Stücke: Lieferzeit 10-14 Tag (e) |
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806-22-001-30-010191 | Mill-Max Manufacturing Corp. |
Description: CONTACT SPRING LOADED SMD GOLD Plunger Size: 0.042" (1.07mm) Dia Pad Layout Dimension: Circular - 0.072" (1.83mm) Maximum Working Height: 0.217" (5.51mm) Part Status: Active Mating Cycles: 1000000 Contact Material: Copper Alloy Contact Finish Thickness: 20.0µin (0.51µm) Contact Type: Sleeve & Plunger (Pogo Pins) Mounting Type: Surface Mount Contact Finish: Gold Features: Pick and Place Packaging: Cut Tape (CT) Current Rating (Amps): 2A Operating Force - Mid Compression: 60gf Operating Force - Initial: 25gf |
auf Bestellung 1399 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 806-22-001-30-010191 |
|
Hersteller: Mill-Max
Circuit Board Hardware - PCB SMT SpringPin RmvblCap H.217
Circuit Board Hardware - PCB SMT SpringPin RmvblCap H.217
auf Bestellung 745 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.07 EUR |
| 10+ | 1.57 EUR |
| 100+ | 1.4 EUR |
| 500+ | 1.3 EUR |
| 750+ | 1.2 EUR |
| 2250+ | 1.11 EUR |
| 806-22-001-30-010191 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONTACT SPRING LOADED SMD GOLD
Plunger Size: 0.042" (1.07mm) Dia
Pad Layout Dimension: Circular - 0.072" (1.83mm)
Maximum Working Height: 0.217" (5.51mm)
Part Status: Active
Mating Cycles: 1000000
Contact Material: Copper Alloy
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Type: Sleeve & Plunger (Pogo Pins)
Mounting Type: Surface Mount
Contact Finish: Gold
Features: Pick and Place
Packaging: Cut Tape (CT)
Current Rating (Amps): 2A
Operating Force - Mid Compression: 60gf
Operating Force - Initial: 25gf
Description: CONTACT SPRING LOADED SMD GOLD
Plunger Size: 0.042" (1.07mm) Dia
Pad Layout Dimension: Circular - 0.072" (1.83mm)
Maximum Working Height: 0.217" (5.51mm)
Part Status: Active
Mating Cycles: 1000000
Contact Material: Copper Alloy
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Type: Sleeve & Plunger (Pogo Pins)
Mounting Type: Surface Mount
Contact Finish: Gold
Features: Pick and Place
Packaging: Cut Tape (CT)
Current Rating (Amps): 2A
Operating Force - Mid Compression: 60gf
Operating Force - Initial: 25gf
auf Bestellung 1399 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.07 EUR |
| 12+ | 1.77 EUR |
| 25+ | 1.65 EUR |
| 50+ | 1.58 EUR |
| 100+ | 1.5 EUR |
| 250+ | 1.4 EUR |