807-22-001-30-002101 Mill-Max
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.92 EUR |
| 10+ | 1.62 EUR |
| 25+ | 1.56 EUR |
| 100+ | 1.45 EUR |
| 250+ | 1.32 EUR |
| 500+ | 1.19 EUR |
| 1000+ | 1.09 EUR |
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Technische Details 807-22-001-30-002101 Mill-Max
Description: CONTACT SPRING LOADED SMD GOLD, Recommended Working Height: 0.135" (3.44mm), Maximum Working Height: 0.155" (3.94mm), Part Status: Active, Mating Cycles: 1000000, Contact Material: Copper Alloy, Contact Finish Thickness: 20.0µin (0.51µm), Contact Type: Sleeve & Plunger (Pogo Pins), Mounting Type: Surface Mount, Contact Finish: Gold, Features: Pick and Place, Packaging: Bulk, Operating Force - Mid Compression: 60gf, Operating Force - Initial: 25gf, Plunger Size: 0.042" (1.07mm) Dia, Pad Layout Dimension: Circular - 0.072" (1.83mm).
Weitere Produktangebote 807-22-001-30-002101 nach Preis ab 1.08 EUR bis 2.05 EUR
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807-22-001-30-002101 | Mill-Max Manufacturing Corp. |
 Description: CONTACT SPRING LOADED SMD GOLDRecommended Working Height: 0.135" (3.44mm) Maximum Working Height: 0.155" (3.94mm) Part Status: Active Mating Cycles: 1000000 Contact Material: Copper Alloy Contact Finish Thickness: 20.0µin (0.51µm) Contact Type: Sleeve & Plunger (Pogo Pins) Mounting Type: Surface Mount Contact Finish: Gold Features: Pick and Place Packaging: Bulk Operating Force - Mid Compression: 60gf Operating Force - Initial: 25gf Plunger Size: 0.042" (1.07mm) Dia Pad Layout Dimension: Circular - 0.072" (1.83mm) |
auf Bestellung 410 Stücke: Lieferzeit 10-14 Tag (e) |
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| 807-22-001-30-002101 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONTACT SPRING LOADED SMD GOLD
Recommended Working Height: 0.135" (3.44mm)
Maximum Working Height: 0.155" (3.94mm)
Part Status: Active
Mating Cycles: 1000000
Contact Material: Copper Alloy
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Type: Sleeve & Plunger (Pogo Pins)
Mounting Type: Surface Mount
Contact Finish: Gold
Features: Pick and Place
Packaging: Bulk
Operating Force - Mid Compression: 60gf
Operating Force - Initial: 25gf
Plunger Size: 0.042" (1.07mm) Dia
Pad Layout Dimension: Circular - 0.072" (1.83mm)
Description: CONTACT SPRING LOADED SMD GOLD
Recommended Working Height: 0.135" (3.44mm)
Maximum Working Height: 0.155" (3.94mm)
Part Status: Active
Mating Cycles: 1000000
Contact Material: Copper Alloy
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Type: Sleeve & Plunger (Pogo Pins)
Mounting Type: Surface Mount
Contact Finish: Gold
Features: Pick and Place
Packaging: Bulk
Operating Force - Mid Compression: 60gf
Operating Force - Initial: 25gf
Plunger Size: 0.042" (1.07mm) Dia
Pad Layout Dimension: Circular - 0.072" (1.83mm)
auf Bestellung 410 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.05 EUR |
| 14+ | 1.56 EUR |
| 25+ | 1.4 EUR |
| 50+ | 1.3 EUR |
| 100+ | 1.2 EUR |
| 250+ | 1.08 EUR |