8080-1G15 TE Connectivity


pgurl_80801g15.pdf
Hersteller: TE Connectivity
Conn Transistor Socket SKT 3 POS Solder ST Panel Mount
auf Bestellung 259 Stücke:
Lieferzeit 14-21 Tag (e)
AnzahlPrivatkunde
10+19.31 EUR
35+18.71 EUR
65+17.93 EUR
150+17.2 EUR
Mindestbestellmenge: 10 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details 8080-1G15 TE Connectivity

Description: CONN TRANSIST TO-3 3POS TIN-LEAD, Part Status: Last Time Buy, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin-Lead, Housing Material: Fluoropolymer (FP), Termination: Solder, Number of Positions or Pins (Grid): 3 (Oval), Operating Temperature: -55°C ~ 125°C, Type: Transistor, TO-3, Mounting Type: Chassis Mount, Features: Closed Frame, Packaging: Bulk.

Weitere Produktangebote 8080-1G15 nach Preis ab 25.49 EUR bis 31.17 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
8080-1G15 8080-1G15 TE Connectivity AMP Connectors 8080-1Gx_1437504_Dwg.pdf Description: CONN TRANSIST TO-3 3POS TIN-LEAD
Part Status: Last Time Buy
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Housing Material: Fluoropolymer (FP)
Termination: Solder
Number of Positions or Pins (Grid): 3 (Oval)
Operating Temperature: -55°C ~ 125°C
Type: Transistor, TO-3
Mounting Type: Chassis Mount
Features: Closed Frame
Packaging: Bulk
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.17 EUR
10+30.52 EUR
25+29.71 EUR
50+28.25 EUR
100+25.49 EUR
Im Einkaufswagen  Stück im Wert von  UAH
8080-1G15 8080-1Gx_1437504_Dwg.pdf
Hersteller: TE Connectivity AMP Connectors
Description: CONN TRANSIST TO-3 3POS TIN-LEAD
Part Status: Last Time Buy
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Housing Material: Fluoropolymer (FP)
Termination: Solder
Number of Positions or Pins (Grid): 3 (Oval)
Operating Temperature: -55°C ~ 125°C
Type: Transistor, TO-3
Mounting Type: Chassis Mount
Features: Closed Frame
Packaging: Bulk
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+31.17 EUR
10+30.52 EUR
25+29.71 EUR
50+28.25 EUR
100+25.49 EUR
Im Einkaufswagen  Stück im Wert von  UAH