8080-1G15 TE Connectivity
| Anzahl | Privatkunde |
|---|---|
| 10+ | 19.31 EUR |
| 35+ | 18.71 EUR |
| 65+ | 17.93 EUR |
| 150+ | 17.2 EUR |
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Technische Details 8080-1G15 TE Connectivity
Description: CONN TRANSIST TO-3 3POS TIN-LEAD, Part Status: Last Time Buy, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Finish - Mating: Tin-Lead, Housing Material: Fluoropolymer (FP), Termination: Solder, Number of Positions or Pins (Grid): 3 (Oval), Operating Temperature: -55°C ~ 125°C, Type: Transistor, TO-3, Mounting Type: Chassis Mount, Features: Closed Frame, Packaging: Bulk.
Weitere Produktangebote 8080-1G15 nach Preis ab 25.49 EUR bis 31.17 EUR
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8080-1G15 | TE Connectivity AMP Connectors |
Description: CONN TRANSIST TO-3 3POS TIN-LEADPart Status: Last Time Buy Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin-Lead Housing Material: Fluoropolymer (FP) Termination: Solder Number of Positions or Pins (Grid): 3 (Oval) Operating Temperature: -55°C ~ 125°C Type: Transistor, TO-3 Mounting Type: Chassis Mount Features: Closed Frame Packaging: Bulk |
auf Bestellung 213 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 8080-1G15 |
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Hersteller: TE Connectivity AMP Connectors
Description: CONN TRANSIST TO-3 3POS TIN-LEAD
Part Status: Last Time Buy
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Housing Material: Fluoropolymer (FP)
Termination: Solder
Number of Positions or Pins (Grid): 3 (Oval)
Operating Temperature: -55°C ~ 125°C
Type: Transistor, TO-3
Mounting Type: Chassis Mount
Features: Closed Frame
Packaging: Bulk
Description: CONN TRANSIST TO-3 3POS TIN-LEAD
Part Status: Last Time Buy
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Housing Material: Fluoropolymer (FP)
Termination: Solder
Number of Positions or Pins (Grid): 3 (Oval)
Operating Temperature: -55°C ~ 125°C
Type: Transistor, TO-3
Mounting Type: Chassis Mount
Features: Closed Frame
Packaging: Bulk
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.17 EUR |
| 10+ | 30.52 EUR |
| 25+ | 29.71 EUR |
| 50+ | 28.25 EUR |
| 100+ | 25.49 EUR |


