8080-1G15 TE Connectivity
| Anzahl | Privatkunde |
|---|---|
| 10+ | 19.54 EUR |
| 35+ | 18.92 EUR |
| 65+ | 18.14 EUR |
| 150+ | 17.4 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
10 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details 8080-1G15 TE Connectivity
Description: CONN TRANSIST TO-3 3POS TIN-LEAD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Chassis Mount, Type: Transistor, TO-3, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 3 (Oval), Termination: Solder, Housing Material: Fluoropolymer (FP), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 200.0µin (5.08µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Last Time Buy.
Weitere Produktangebote 8080-1G15 nach Preis ab 25.49 EUR bis 31.17 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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8080-1G15 | TE Connectivity AMP Connectors |
 Description: CONN TRANSIST TO-3 3POS TIN-LEADFeatures: Closed Frame Packaging: Bulk Mounting Type: Chassis Mount Type: Transistor, TO-3 Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 3 (Oval) Termination: Solder Housing Material: Fluoropolymer (FP) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Beryllium Copper Part Status: Last Time Buy |
auf Bestellung 213 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 8080-1G15 |
|
Hersteller: TE Connectivity AMP Connectors
Description: CONN TRANSIST TO-3 3POS TIN-LEAD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Chassis Mount
Type: Transistor, TO-3
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (Oval)
Termination: Solder
Housing Material: Fluoropolymer (FP)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Last Time Buy
Description: CONN TRANSIST TO-3 3POS TIN-LEAD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Chassis Mount
Type: Transistor, TO-3
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (Oval)
Termination: Solder
Housing Material: Fluoropolymer (FP)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Last Time Buy
auf Bestellung 213 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 31.17 EUR |
| 10+ | 30.52 EUR |
| 25+ | 29.71 EUR |
| 50+ | 28.25 EUR |
| 100+ | 25.49 EUR |