Technische Details 8080-1G24 TE Connectivity / AMP
Description: CONN SOCKET TRANSIST TO-3 3POS, Features: Closed Frame, Packaging: Bulk, Mounting Type: Chassis Mount, Type: Transistor, TO-3, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 3 (Round), Termination: Solder, Housing Material: Diallyl Phthalate (DAP), Contact Finish - Mating: Tin-Lead, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 20.0µin (0.51µm), Contact Material - Post: Beryllium Copper, Part Status: Last Time Buy.
Weitere Produktangebote 8080-1G24 nach Preis ab 23.64 EUR bis 29.09 EUR
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8080-1G24 | TE Connectivity AMP Connectors |
 Description: CONN SOCKET TRANSIST TO-3 3POSFeatures: Closed Frame Packaging: Bulk Mounting Type: Chassis Mount Type: Transistor, TO-3 Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 3 (Round) Termination: Solder Housing Material: Diallyl Phthalate (DAP) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Material - Mating: Beryllium Copper Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 20.0µin (0.51µm) Contact Material - Post: Beryllium Copper Part Status: Last Time Buy |
auf Bestellung 388 Stücke: Lieferzeit 10-14 Tag (e) |
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| 8080-1G24 |
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Hersteller: TE Connectivity AMP Connectors
Description: CONN SOCKET TRANSIST TO-3 3POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Chassis Mount
Type: Transistor, TO-3
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (Round)
Termination: Solder
Housing Material: Diallyl Phthalate (DAP)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Last Time Buy
Description: CONN SOCKET TRANSIST TO-3 3POS
Features: Closed Frame
Packaging: Bulk
Mounting Type: Chassis Mount
Type: Transistor, TO-3
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (Round)
Termination: Solder
Housing Material: Diallyl Phthalate (DAP)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 20.0µin (0.51µm)
Contact Material - Post: Beryllium Copper
Part Status: Last Time Buy
auf Bestellung 388 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 29.09 EUR |
| 10+ | 28.48 EUR |
| 25+ | 27.73 EUR |
| 50+ | 26.36 EUR |
| 100+ | 23.79 EUR |
| 250+ | 23.64 EUR |