Produkte > TE CONNECTIVITY AMP CONNECTORS > 814-AG11D

814-AG11D TE Connectivity AMP Connectors

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Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 14POS GOLD
Contact Finish Thickness - Post: 80.0µin (2.03µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Copper Alloy
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Contact Material - Post: Copper Alloy

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Technische Details 814-AG11D TE Connectivity AMP Connectors

Description: CONN IC DIP SOCKET 14POS GOLD, Contact Finish Thickness - Post: 80.0µin (2.03µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Termination: Solder, Number of Positions or Pins (Grid): 14 (2 x 7), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Contact Material - Post: Copper Alloy.