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824-AG31D

824-AG31D TE Connectivity

DDEController?Action=showdoc&DocId=Customer+Drawing%7F1437539-2%7FA3%7Fpdf%7FEnglish%7FENG_CD_1437539-2_A3.pdf%7F1437539-2
Hersteller: TE Connectivity
IC & Component Sockets DIP-24 IC SOCKET 1600
auf Bestellung 531 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+32.46 EUR
10+23.56 EUR
20+20.53 EUR
60+20.5 EUR
100+20.15 EUR
500+19.9 EUR
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Technische Details 824-AG31D TE Connectivity

Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Material - Post: Copper Alloy.

Weitere Produktangebote 824-AG31D

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
824-AG31D 824-AG31D TE Connectivity AMP Connectors DDEController?Action=showdoc&DocId=Customer+Drawing%7F1437539-2%7FA3%7Fpdf%7FEnglish%7FENG_CD_1437539-2_A3.pdf%7F1437539-2 Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
824-AG31D DDEController?Action=showdoc&DocId=Customer+Drawing%7F1437539-2%7FA3%7Fpdf%7FEnglish%7FENG_CD_1437539-2_A3.pdf%7F1437539-2
824-AG31D
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH