828-AG11D-ESL TE Connectivity AMP Connectors

Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 5.00µin (0.127µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Part Status: Obsolete
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details 828-AG11D-ESL TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 28POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 5.00µin (0.127µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Part Status: Obsolete.
Weitere Produktangebote 828-AG11D-ESL
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
![]() |
828-AG11D-ESL | Hersteller : TE Connectivity |
![]() |
Produkt ist nicht verfügbar |