Technische Details 832-AG11D-ESL-LF TE Connectivity
Description: CONN IC DIP SOCKET 32POS GOLD, Contact Material - Post: Copper Alloy, Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Copper Alloy, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote 832-AG11D-ESL-LF
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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832-AG11D-ESL-LF | Hersteller : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 32POS GOLDContact Material - Post: Copper Alloy Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Copper Alloy Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
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