8420-21B1-RK-TR

8420-21B1-RK-TR 3M Electronic Solutions Division


ea8fbb9b2c8a12082b4e098b7eac8f93733b1349-2951642.pdf Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 20POS PLCC SOCKET
auf Bestellung 88 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+3.57 EUR
10+ 3.12 EUR
100+ 2.78 EUR
500+ 2.32 EUR
1000+ 1.92 EUR
1500+ 1.87 EUR
4500+ 1.81 EUR
Produktrezensionen
Produktbewertung abgeben

Technische Details 8420-21B1-RK-TR 3M Electronic Solutions Division

Description: CONN SOCKET PLCC 20POS TIN, Packaging: Tape & Reel (TR), Features: Closed Frame, Mounting Type: Surface Mount, Type: PLCC, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 20 (4 x 5), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 160.0µin (4.06µm), Contact Material - Post: Copper Alloy.

Weitere Produktangebote 8420-21B1-RK-TR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
8420-21B1-RK-TR 8420-21B1-RK-TR Hersteller : 3M 3mtm-chip-carrier-sockets-4-row-sm-8400-series-ts2147.pdf Description: CONN SOCKET PLCC 20POS TIN
Packaging: Tape & Reel (TR)
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 20 (4 x 5)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Copper Alloy
Produkt ist nicht verfügbar