8432-11B1-RK-TP 3M Electronic Solutions Division


ts2148.pdf
Hersteller: 3M Electronic Solutions Division
IC & Component Sockets 32P PLCC SOCKET THRU-HOLE
auf Bestellung 1825 Stücke:

Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+2.53 EUR
10+2.27 EUR
25+2.22 EUR
50+2.13 EUR
100+2.02 EUR
250+1.9 EUR
500+1.81 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details 8432-11B1-RK-TP 3M Electronic Solutions Division

Description: CONN SOCKET PLCC 32POS TIN, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: PLCC, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 160.0µin (4.06µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 160.0µin (4.06µm), Contact Material - Post: Copper Alloy, Part Status: Active.

Weitere Produktangebote 8432-11B1-RK-TP nach Preis ab 1.73 EUR bis 2.83 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
8432-11B1-RK-TP 8432-11B1-RK-TP 3M 3mtm-chip-carrier-sockets-lp-4-row-t-h-8400-series-ts2148.pdf Description: CONN SOCKET PLCC 32POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Copper Alloy
Part Status: Active
auf Bestellung 1363 Stücke:
Lieferzeit 10-14 Tag (e)
7+2.83 EUR
10+2.4 EUR
29+2.22 EUR
58+2.12 EUR
116+2.02 EUR
261+1.9 EUR
522+1.81 EUR
1015+1.73 EUR
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
8432-11B1-RK-TP 3mtm-chip-carrier-sockets-lp-4-row-t-h-8400-series-ts2148.pdf
Hersteller: 3M
Description: CONN SOCKET PLCC 32POS TIN
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: PLCC
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 160.0µin (4.06µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 160.0µin (4.06µm)
Contact Material - Post: Copper Alloy
Part Status: Active
auf Bestellung 1363 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
7+2.83 EUR
10+2.4 EUR
29+2.22 EUR
58+2.12 EUR
116+2.02 EUR
261+1.9 EUR
522+1.81 EUR
1015+1.73 EUR
Mindestbestellmenge: 7 Stücke
Im Einkaufswagen  Stück im Wert von  UAH