84517-001LF Amphenol Communications Solutions
Hersteller: Amphenol Communications Solutions200 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
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Technische Details 84517-001LF Amphenol Communications Solutions
Description: CONN ARRAY RCPT 200POS SMD GOLD, Packaging: Bulk, Connector Type: Array, Female Sockets, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 200, Pitch: 0.050" (1.27mm), Height Above Board: 0.132" (3.35mm), Contact Finish Thickness: 15.0µin (0.38µm), Mated Stacking Heights: 4mm, 10mm, Part Status: Active, Number of Rows: 10.
Weitere Produktangebote 84517-001LF
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84517-001LF | Hersteller : FCI |
Conn Board to Board RCP 200 POS 1.27mm Solder ST SMD T/R |
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| 84517-001LF | Hersteller : Amphenol ICC (FCI) |
Description: CONN ARRAY RCPT 200POS SMD GOLD Packaging: Bulk Connector Type: Array, Female Sockets Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 200 Pitch: 0.050" (1.27mm) Height Above Board: 0.132" (3.35mm) Contact Finish Thickness: 15.0µin (0.38µm) Mated Stacking Heights: 4mm, 10mm Part Status: Active Number of Rows: 10 |
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84517-001LF | Hersteller : Amphenol FCI |
Board to Board & Mezzanine Connectors 200P RECEPTACLE 4MM STACK HEIGHT |
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84517-001LF | Hersteller : Amphenol / InterCon Systems |
Board to Board & Mezzanine Connectors 200P RECEPTACLE 4MM STACK HEIGHT |
Produkt ist nicht verfügbar |