901-19-1-12-2-B-0 Wakefield Thermal Solutions
Hersteller: Wakefield Thermal Solutions
Description: HEATSINK 19X19X12MM ELLIPTICAL
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 6.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 14.70°C/W
Fin Height: 0.457" (11.60mm)
Material Finish: Black Anodized
Part Status: Active
| Anzahl | Preis |
|---|---|
| 2+ | 11.21 EUR |
| 10+ | 9.91 EUR |
| 25+ | 9.44 EUR |
| 90+ | 8.82 EUR |
| 180+ | 8.5 EUR |
| 270+ | 8.32 EUR |
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Technische Details 901-19-1-12-2-B-0 Wakefield Thermal Solutions
Description: HEATSINK 19X19X12MM ELLIPTICAL, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Thermal Resistance @ Forced Air Flow: 6.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 14.70°C/W, Fin Height: 0.457" (11.60mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 901-19-1-12-2-B-0 nach Preis ab 14.3 EUR bis 14.3 EUR
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901-19-1-12-2-B-0 | Hersteller : Wakefield Thermal |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 19mm; W: 19mm; H: 11.6mm Type of heatsink: extruded Heatsink shape: grilled Application: BGA Colour: black Length: 19mm Width: 19mm Height: 11.6mm Material: aluminium Material finishing: anodized Heatsinks features: delivered with holder Thermal resistance @200 LFM: 6.6°C/W Manufacturer series: 900 |
auf Bestellung 5 Stücke: Lieferzeit 14-21 Tag (e) |
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901-19-1-12-2-B-0 | Hersteller : Wakefield Thermal |
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 19mm Chip Size, 11.6mm Height, Aluminum |
Produkt ist nicht verfügbar |