902-21-1-33-2-B-0 Wakefield Thermal Solutions
Hersteller: Wakefield Thermal Solutions
Description: HEAT SINK ELLIP FIN 21X21MM CLIP
Material Finish: Black Anodized
Fin Height: 1.283" (32.60mm)
Thermal Resistance @ Natural: 9.30°C/W
Thermal Resistance @ Forced Air Flow: 3.57°C/W @ 200 LFM
Attachment Method: Push Pin
Package Cooled: BGA
Width: 0.827" (21.00mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 0.827" (21.00mm)
Material: Aluminum
Packaging: Box
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Technische Details 902-21-1-33-2-B-0 Wakefield Thermal Solutions
Description: HEAT SINK ELLIP FIN 21X21MM CLIP, Material Finish: Black Anodized, Fin Height: 1.283" (32.60mm), Thermal Resistance @ Natural: 9.30°C/W, Thermal Resistance @ Forced Air Flow: 3.57°C/W @ 200 LFM, Attachment Method: Push Pin, Package Cooled: BGA, Width: 0.827" (21.00mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 0.827" (21.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote 902-21-1-33-2-B-0
| Foto | Bezeichnung | Hersteller | Beschreibung |
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902-21-1-33-2-B-0 | Hersteller : Wakefield Thermal |
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 32.6mm Height, Aluminum |
Produkt ist nicht verfügbar |
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| 902-21-1-33-2-B-0 | Hersteller : Wakefield Thermal |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 21mm; W: 21mm; H: 32.6mm Manufacturer series: 900 Type of heatsink: extruded Heatsink shape: grilled Width: 21mm Length: 21mm Height: 32.6mm Thermal resistance @200 LFM: 4.18°C/W Material: aluminium Material finishing: anodized Application: BGA Colour: black |
Produkt ist nicht verfügbar |