902-21-1-33-2-B-0 Wakefield Thermal Solutions
Hersteller: Wakefield Thermal SolutionsDescription: HEAT SINK ELLIP FIN 21X21MM CLIP
Packaging: Box
Material: Aluminum
Length: 0.827" (21.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.827" (21.00mm)
Package Cooled: BGA
Attachment Method: Push Pin
Thermal Resistance @ Forced Air Flow: 3.57°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.30°C/W
Fin Height: 1.283" (32.60mm)
Material Finish: Black Anodized
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Technische Details 902-21-1-33-2-B-0 Wakefield Thermal Solutions
Description: HEAT SINK ELLIP FIN 21X21MM CLIP, Packaging: Box, Material: Aluminum, Length: 0.827" (21.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.827" (21.00mm), Package Cooled: BGA, Attachment Method: Push Pin, Thermal Resistance @ Forced Air Flow: 3.57°C/W @ 200 LFM, Thermal Resistance @ Natural: 9.30°C/W, Fin Height: 1.283" (32.60mm), Material Finish: Black Anodized.
Weitere Produktangebote 902-21-1-33-2-B-0
| Foto | Bezeichnung | Hersteller | Beschreibung |
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902-21-1-33-2-B-0 | Hersteller : Wakefield Thermal |
Heat Sinks Chipset Heat Sink with Clip, Elliptical, 21mm Chip Size, 32.6mm Height, Aluminum |
Produkt ist nicht verfügbar |
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| 902-21-1-33-2-B-0 | Hersteller : Wakefield Thermal |
Category: Heatsinks Description: Heatsink: extruded; grilled; BGA; black; L: 21mm; W: 21mm; H: 32.6mm Type of heatsink: extruded Heatsink shape: grilled Application: BGA Colour: black Length: 21mm Width: 21mm Height: 32.6mm Material: aluminium Material finishing: anodized Thermal resistance @200 LFM: 4.18°C/W Manufacturer series: 900 |
Produkt ist nicht verfügbar |