90599-007LF Amphenol Communications Solutions-FCI

Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header,Through Hole, Double Row, 20 Positions, 2.00mm (0.079in) Pitch
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Technische Details 90599-007LF Amphenol Communications Solutions-FCI
Description: CONN HDR 20POS 0.079" STACK TH, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 8.00µin (0.203µm), Number of Rows: 2, Number of Positions: 20, Length - Overall Pin: 0.512" (13.000mm), Length - Post (Mating): 0.157" (4.000mm), Length - Stack Height: 0.236" (6.000mm), Length - Tail: 0.118" (3.000mm).
Weitere Produktangebote 90599-007LF
Foto | Bezeichnung | Hersteller | Beschreibung |
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90599-007LF | Hersteller : Amphenol ICC (FCI) |
![]() Packaging: Bulk Color: Black Mounting Type: Through Hole Pitch: 0.079" (2.00mm) Row Spacing: 0.079" (2.00mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 8.00µin (0.203µm) Number of Rows: 2 Number of Positions: 20 Length - Overall Pin: 0.512" (13.000mm) Length - Post (Mating): 0.157" (4.000mm) Length - Stack Height: 0.236" (6.000mm) Length - Tail: 0.118" (3.000mm) |
Produkt ist nicht verfügbar |
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90599-007LF | Hersteller : Amphenol FCI |
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Produkt ist nicht verfügbar |