FI-S8P-HFE JAE Electronics
auf Bestellung 580 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 9+ | 6.4 EUR |
| 10+ | 5.62 EUR |
| 100+ | 4.97 EUR |
| 250+ | 4.81 EUR |
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Technische Details FI-S8P-HFE JAE Electronics
Description: CONN HEADER SMD R/A 8POS 1.25MM, Features: Solder Retention, Packaging: Strip, Connector Type: Receptacle, Voltage Rating: 200V, Current Rating (Amps): 1A per Contact, Mounting Type: Surface Mount, Right Angle, Number of Positions: 8, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 80°C, Contact Type: Male Pin, Fastening Type: Friction Lock, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Copper Alloy, Insulation Color: Beige, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish - Post: Tin or Tin-Alloy, Part Status: Active, Contact Shape: Square, Insulation Height: 0.071" (1.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled.
Weitere Produktangebote FI-S8P-HFE nach Preis ab 3.69 EUR bis 7.1 EUR
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FI-S8P-HFE | Hersteller : JAE Electronics |
 Description: CONN HEADER SMD R/A 8POS 1.25MMFeatures: Solder Retention Packaging: Strip Connector Type: Receptacle Voltage Rating: 200V Current Rating (Amps): 1A per Contact Mounting Type: Surface Mount, Right Angle Number of Positions: 8 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 80°C Contact Type: Male Pin Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Beige Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Gold Contact Finish - Post: Tin or Tin-Alloy Part Status: Active Contact Shape: Square Insulation Height: 0.071" (1.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP), Glass Filled |
auf Bestellung 6651 Stücke: Lieferzeit 21-28 Tag (e) |
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