Produkte > MICROSEMI CORPORATION > A3P250L-1FGG144
A3P250L-1FGG144

A3P250L-1FGG144 Microsemi Corporation

ProASIC3L_Series_DS_Rev4.pdf Hersteller: Microsemi Corporation
Description: IC FPGA 97 I/O 144FBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Number of Gates: 250000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.575V
Supplier Device Package: 144-FPBGA (13x13)
Total RAM Bits: 36864
Part Status: Obsolete
Number of I/O: 97
DigiKey Programmable: Not Verified
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Technische Details A3P250L-1FGG144 Microsemi Corporation

Description: IC FPGA 97 I/O 144FBGA, Packaging: Tray, Package / Case: 144-LBGA, Mounting Type: Surface Mount, Number of Gates: 250000, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.14V ~ 1.575V, Supplier Device Package: 144-FPBGA (13x13), Total RAM Bits: 36864, Part Status: Obsolete, Number of I/O: 97, DigiKey Programmable: Not Verified.