Technische Details AF016GEC5A-2001IX ATP Electronics
Description: IC FLASH 128GBIT EMMC 153BGA, Memory Organization: 16G x 8, Memory Interface: eMMC, Part Status: Active, Supplier Device Package: 153-BGA (11.5x13), Memory Format: FLASH, Technology: FLASH - NAND (pSLC), Operating Temperature: -40°C ~ 85°C, Memory Type: Non-Volatile, Memory Size: 128Gbit, Mounting Type: Surface Mount, Package / Case: 153-FBGA, Packaging: Tray.
Weitere Produktangebote AF016GEC5A-2001IX nach Preis ab 55.67 EUR bis 55.67 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
||
|---|---|---|---|---|---|---|---|
|
AF016GEC5A-2001IX | ATP Electronics, Inc. |
Description: IC FLASH 128GBIT EMMC 153BGAMemory Organization: 16G x 8 Memory Interface: eMMC Part Status: Active Supplier Device Package: 153-BGA (11.5x13) Memory Format: FLASH Technology: FLASH - NAND (pSLC) Operating Temperature: -40°C ~ 85°C Memory Type: Non-Volatile Memory Size: 128Gbit Mounting Type: Surface Mount Package / Case: 153-FBGA Packaging: Tray |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
|
| AF016GEC5A-2001IX |
![]() |
Hersteller: ATP Electronics, Inc.
Description: IC FLASH 128GBIT EMMC 153BGA
Memory Organization: 16G x 8
Memory Interface: eMMC
Part Status: Active
Supplier Device Package: 153-BGA (11.5x13)
Memory Format: FLASH
Technology: FLASH - NAND (pSLC)
Operating Temperature: -40°C ~ 85°C
Memory Type: Non-Volatile
Memory Size: 128Gbit
Mounting Type: Surface Mount
Package / Case: 153-FBGA
Packaging: Tray
Description: IC FLASH 128GBIT EMMC 153BGA
Memory Organization: 16G x 8
Memory Interface: eMMC
Part Status: Active
Supplier Device Package: 153-BGA (11.5x13)
Memory Format: FLASH
Technology: FLASH - NAND (pSLC)
Operating Temperature: -40°C ~ 85°C
Memory Type: Non-Volatile
Memory Size: 128Gbit
Mounting Type: Surface Mount
Package / Case: 153-FBGA
Packaging: Tray
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 55.67 EUR |



