AOS 218 247 1 Fischer Elektronik
| Anzahl | Privatkunde |
|---|---|
| 43+ | 4 EUR |
| 44+ | 3.81 EUR |
| 100+ | 3.63 EUR |
| 500+ | 3.44 EUR |
| 1000+ | 3.27 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
14-21 Tag (e)
Mindestmenge:
43 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details AOS 218 247 1 Fischer Elektronik
Category: Heatsinks - equipment, Description: Heat transfer pad; ceramic; TO218,TO247; L: 21mm; W: 25mm; 25W/mK, Type of heatsink accessories: heat transfer pad, Kind of heat transfer pad: ceramic, Application: TO218; TO247, Length: 21mm, Width: 25mm, Thickness: 1.5mm, Thermal conductivity: 25W/mK, Electrical insulation: 10kV/mm, Mounting hole diameter: 4mm, Pad volume resistance: 100TΩ/cm.
Weitere Produktangebote AOS 218 247 1 nach Preis ab 2.98 EUR bis 11.94 EUR
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AOS 218 247 1 | Fischer Elektronik |
 Thrml Mgmt Access Aluminium Oxide Wafer 0.3°C/W 25W/m·K Aluminum |
auf Bestellung 2876 Stücke: Lieferzeit 14-21 Tag (e) |
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AOS 218 247 1 | Fischer Elektronik |
Thrml Mgmt Access Aluminium Oxide Wafer 0.3°C/W 25W/m·K Aluminum |
auf Bestellung 1449 Stücke: Lieferzeit 14-21 Tag (e) |
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AOS 218 247 1 | Fischer Elektronik |
Description: Aluminium oxide wafers AOS 218 2 Packaging: Bulk Material: Aluminum Oxide Ceramic Shape: Rectangular Thickness: 0.0591" (1.500mm) Thermal Resistivity: 0.30°C/W Usage: TO-218 Outline: 21.00mm x 25.00mm Thermal Conductivity: 9.0W/m-K Adhesive: None |
auf Bestellung 9189 Stücke: Lieferzeit 10-14 Tag (e) |
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AOS 218 247 1 | FISCHER ELEKTRONIK |
Category: Heatsinks - equipment Description: Heat transfer pad; ceramic; TO218,TO247; L: 21mm; W: 25mm; 25W/mK Type of heatsink accessories: heat transfer pad Kind of heat transfer pad: ceramic Application: TO218; TO247 Length: 21mm Width: 25mm Thickness: 1.5mm Thermal conductivity: 25W/mK Electrical insulation: 10kV/mm Mounting hole diameter: 4mm Pad volume resistance: 100TΩ/cm |
auf Bestellung 1449 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| AOS 218/247-1 | RICHONE | Aluminium oxide wafers for TO218/TO247 Dimensions: 25x21x1.5mm; with hole ?4mm; 0.3K/W; 25W/m*K; (Fischer : AOS 218 247-1 Thickness 1.5mm) TPTO218/247cer-1 |
auf Bestellung 150 Stücke: Lieferzeit 7-14 Tag (e) |
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| AOS 218 247 1 |
|
Hersteller: Fischer Elektronik
Thrml Mgmt Access Aluminium Oxide Wafer 0.3°C/W 25W/m·K Aluminum
Thrml Mgmt Access Aluminium Oxide Wafer 0.3°C/W 25W/m·K Aluminum
auf Bestellung 2876 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 43+ | 4.08 EUR |
| 44+ | 3.95 EUR |
| 100+ | 3.82 EUR |
| 500+ | 3.72 EUR |
| 1000+ | 3.63 EUR |
| AOS 218 247 1 |
|
Hersteller: Fischer Elektronik
Thrml Mgmt Access Aluminium Oxide Wafer 0.3°C/W 25W/m·K Aluminum
Thrml Mgmt Access Aluminium Oxide Wafer 0.3°C/W 25W/m·K Aluminum
auf Bestellung 1449 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 25+ | 7.31 EUR |
| 27+ | 6.5 EUR |
| 100+ | 5.43 EUR |
| 1000+ | 4.57 EUR |
| AOS 218 247 1 |
|
Hersteller: Fischer Elektronik
Description: Aluminium oxide wafers AOS 218 2
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0591" (1.500mm)
Thermal Resistivity: 0.30°C/W
Usage: TO-218
Outline: 21.00mm x 25.00mm
Thermal Conductivity: 9.0W/m-K
Adhesive: None
Description: Aluminium oxide wafers AOS 218 2
Packaging: Bulk
Material: Aluminum Oxide Ceramic
Shape: Rectangular
Thickness: 0.0591" (1.500mm)
Thermal Resistivity: 0.30°C/W
Usage: TO-218
Outline: 21.00mm x 25.00mm
Thermal Conductivity: 9.0W/m-K
Adhesive: None
auf Bestellung 9189 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 11.94 EUR |
| AOS 218 247 1 |
|
Hersteller: FISCHER ELEKTRONIK
Category: Heatsinks - equipment
Description: Heat transfer pad; ceramic; TO218,TO247; L: 21mm; W: 25mm; 25W/mK
Type of heatsink accessories: heat transfer pad
Kind of heat transfer pad: ceramic
Application: TO218; TO247
Length: 21mm
Width: 25mm
Thickness: 1.5mm
Thermal conductivity: 25W/mK
Electrical insulation: 10kV/mm
Mounting hole diameter: 4mm
Pad volume resistance: 100TΩ/cm
Category: Heatsinks - equipment
Description: Heat transfer pad; ceramic; TO218,TO247; L: 21mm; W: 25mm; 25W/mK
Type of heatsink accessories: heat transfer pad
Kind of heat transfer pad: ceramic
Application: TO218; TO247
Length: 21mm
Width: 25mm
Thickness: 1.5mm
Thermal conductivity: 25W/mK
Electrical insulation: 10kV/mm
Mounting hole diameter: 4mm
Pad volume resistance: 100TΩ/cm
auf Bestellung 1449 Stücke:
Lieferzeit 14-21 Tag (e)
| AOS 218/247-1 |
Hersteller: RICHONE
Aluminium oxide wafers for TO218/TO247 Dimensions: 25x21x1.5mm; with hole ?4mm; 0.3K/W; 25W/m*K; (Fischer : AOS 218 247-1 Thickness 1.5mm) TPTO218/247cer-1
Aluminium oxide wafers for TO218/TO247 Dimensions: 25x21x1.5mm; with hole ?4mm; 0.3K/W; 25W/m*K; (Fischer : AOS 218 247-1 Thickness 1.5mm) TPTO218/247cer-1
auf Bestellung 150 Stücke:
Lieferzeit 7-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 2.98 EUR |