APF19-19-13CB/A01 CTS Thermal Management Products

Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 0.748" (19.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 0.748" (19.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 18513 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
3+ | 6.18 EUR |
10+ | 5.46 EUR |
25+ | 5.21 EUR |
50+ | 5.02 EUR |
100+ | 4.84 EUR |
250+ | 4.61 EUR |
500+ | 4.44 EUR |
1960+ | 4.13 EUR |
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Technische Details APF19-19-13CB/A01 CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized.
Weitere Produktangebote APF19-19-13CB/A01 nach Preis ab 6.35 EUR bis 8.78 EUR
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APF19-19-13CB/A01 | Hersteller : CTS Electronic Components |
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auf Bestellung 2231 Stücke: Lieferzeit 10-14 Tag (e) |
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