Technische Details APF19-19-13CB/A01 CTS Electronic Components
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized.
Weitere Produktangebote APF19-19-13CB/A01 nach Preis ab 4.58 EUR bis 6.28 EUR
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APF19-19-13CB/A01 | Hersteller : CTS Thermal Management Products |
 Description: HEATSINK FORGED W/ADHESIVE TAPEPackaging: Box Material: Aluminum Length: 0.748" (19.00mm) Shape: Square, Fins Type: Top Mount Width: 0.748" (19.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 200 LFM Fin Height: 0.500" (12.70mm) Material Finish: Black Anodized |
auf Bestellung 10008 Stücke: Lieferzeit 10-14 Tag (e) |
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