APF30-30-10CB/A01 CTS Electronic Components
Hersteller: CTS Electronic Components
Heat Sinks Type: Top mount / Shape: Square line fin / Length: 1.181" / Width: 1.181" / Height: 0.374" / Material: Aluminum Alloy / Material Finish: Black Anodize
| Anzahl | Privatkunde |
|---|---|
| 1+ | 13.95 EUR |
| 10+ | 12.65 EUR |
| 20+ | 12.04 EUR |
| 50+ | 11.63 EUR |
| 100+ | 10.12 EUR |
| 200+ | 9.84 EUR |
| 500+ | 9.72 EUR |
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Technische Details APF30-30-10CB/A01 CTS Electronic Components
Description: HEATSINK FORGED W/ADHESIVE TAPE, Material Finish: Black Anodized, Fin Height: 0.370" (9.40mm), Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.181" (30.00mm), Type: Top Mount, Shape: Square, Fins, Length: 1.181" (30.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote APF30-30-10CB/A01 nach Preis ab 12.01 EUR bis 15.33 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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APF303010CBA01 | CTS Thermal Management Products |
Description: HEATSINK FORGED W/ADHESIVE TAPE Material Finish: Black Anodized Fin Height: 0.370" (9.40mm) Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Box |
auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
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APF30-30-10CB/A01 | CTS Thermal Management Products |
Description: HEATSINK FORGED W/ADHESIVE TAPE |
auf Bestellung 161 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| APF303010CBA01 |
|
Hersteller: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
Material Finish: Black Anodized
Fin Height: 0.370" (9.40mm)
Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM
Attachment Method: Thermal Tape, Adhesive (Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Box
Description: HEATSINK FORGED W/ADHESIVE TAPE
Material Finish: Black Anodized
Fin Height: 0.370" (9.40mm)
Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM
Attachment Method: Thermal Tape, Adhesive (Included)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Width: 1.181" (30.00mm)
Type: Top Mount
Shape: Square, Fins
Length: 1.181" (30.00mm)
Material: Aluminum
Packaging: Box
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.33 EUR |
| 10+ | 13.58 EUR |
| 25+ | 12.92 EUR |
| 50+ | 12.46 EUR |
| 100+ | 12.01 EUR |
| APF30-30-10CB/A01 |
|
Hersteller: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
Description: HEATSINK FORGED W/ADHESIVE TAPE
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)