APF30-30-10CB/A01 CTS Electronic Components
Hersteller: CTS Electronic Components
Heat Sinks Type: Top mount / Shape: Square line fin / Length: 1.181" / Width: 1.181" / Height: 0.374" / Material: Aluminum Alloy / Material Finish: Black Anodize
| Anzahl | Privatkunde |
|---|---|
| 1+ | 15.04 EUR |
| 10+ | 14.27 EUR |
| 20+ | 13.47 EUR |
| 50+ | 12.67 EUR |
| 100+ | 12.1 EUR |
| 200+ | 10.94 EUR |
| 500+ | 10.69 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details APF30-30-10CB/A01 CTS Electronic Components
Description: HEATSINK FORGED W/ADHESIVE TAPE, Packaging: Box, Material: Aluminum, Length: 1.181" (30.00mm), Shape: Square, Fins, Type: Top Mount, Width: 1.181" (30.00mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM, Fin Height: 0.370" (9.40mm), Material Finish: Black Anodized.
Weitere Produktangebote APF30-30-10CB/A01 nach Preis ab 12.01 EUR bis 15.33 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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APF303010CBA01 | CTS Thermal Management Products |
Description: HEATSINK FORGED W/ADHESIVE TAPE Packaging: Box Material: Aluminum Length: 1.181" (30.00mm) Shape: Square, Fins Type: Top Mount Width: 1.181" (30.00mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM Fin Height: 0.370" (9.40mm) Material Finish: Black Anodized |
auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
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APF30-30-10CB/A01 | CTS Thermal Management Products |
Description: HEATSINK FORGED W/ADHESIVE TAPE |
auf Bestellung 161 Stücke: Lieferzeit 10-14 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| APF303010CBA01 |
|
Hersteller: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
Description: HEATSINK FORGED W/ADHESIVE TAPE
Packaging: Box
Material: Aluminum
Length: 1.181" (30.00mm)
Shape: Square, Fins
Type: Top Mount
Width: 1.181" (30.00mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM
Fin Height: 0.370" (9.40mm)
Material Finish: Black Anodized
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 15.33 EUR |
| 10+ | 13.58 EUR |
| 25+ | 12.92 EUR |
| 50+ | 12.46 EUR |
| 100+ | 12.01 EUR |
| APF30-30-10CB/A01 |
|
Hersteller: CTS Thermal Management Products
Description: HEATSINK FORGED W/ADHESIVE TAPE
Description: HEATSINK FORGED W/ADHESIVE TAPE
auf Bestellung 161 Stücke:
Lieferzeit 10-14 Tag (e)