APF30-30-10CB/A01 CTS Electronic Components
Hersteller: CTS Electronic Components
Heat Sinks Type: Top mount / Shape: Square line fin / Length: 1.181" / Width: 1.181" / Height: 0.374" / Material: Aluminum Alloy / Material Finish: Black Anodize
| Anzahl | Preis |
|---|---|
| 1+ | 11.72 EUR |
| 10+ | 10.63 EUR |
| 20+ | 10.12 EUR |
| 50+ | 9.77 EUR |
| 100+ | 8.5 EUR |
| 200+ | 8.27 EUR |
| 500+ | 8.17 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details APF30-30-10CB/A01 CTS Electronic Components
Description: HEATSINK FORGED W/ADHESIVE TAPE, Material Finish: Black Anodized, Fin Height: 0.370" (9.40mm), Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM, Attachment Method: Thermal Tape, Adhesive (Included), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Width: 1.181" (30.00mm), Type: Top Mount, Shape: Square, Fins, Length: 1.181" (30.00mm), Material: Aluminum, Packaging: Box.
Weitere Produktangebote APF30-30-10CB/A01 nach Preis ab 10.09 EUR bis 12.88 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
APF303010CBA01 | Hersteller : CTS Thermal Management Products |
Description: HEATSINK FORGED W/ADHESIVE TAPEMaterial Finish: Black Anodized Fin Height: 0.370" (9.40mm) Thermal Resistance @ Forced Air Flow: 3.30°C/W @ 200 LFM Attachment Method: Thermal Tape, Adhesive (Included) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Width: 1.181" (30.00mm) Type: Top Mount Shape: Square, Fins Length: 1.181" (30.00mm) Material: Aluminum Packaging: Box |
auf Bestellung 122 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
APF30-30-10CB/A01 | Hersteller : CTS Thermal Management Products |
Description: HEATSINK FORGED W/ADHESIVE TAPE |
auf Bestellung 161 Stücke: Lieferzeit 10-14 Tag (e) |