APM6-100-01.5-L-08-0-A-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: 0.635 MM ACCELERATE HP HIGH-PERF
Features: Board Guide
Packaging: Tape & Reel (TR)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 800
Pitch: 0.025" (0.64mm)
Height Above Board: 0.144" (3.66mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 5mm
Number of Rows: 8
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Technische Details APM6-100-01.5-L-08-0-A-TR Samtec Inc.
Description: 0.635 MM ACCELERATE HP HIGH-PERF, Features: Board Guide, Packaging: Tape & Reel (TR), Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 800, Pitch: 0.025" (0.64mm), Height Above Board: 0.144" (3.66mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 5mm, Number of Rows: 8.
Weitere Produktangebote APM6-100-01.5-L-08-0-A-TR nach Preis ab 79.31 EUR bis 117.53 EUR
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APM6-100-01.5-L-08-0-A-TR | Samtec Inc. |
Description: 0.635 MM ACCELERATE HP HIGH-PERF Features: Board Guide Packaging: Cut Tape (CT) Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 800 Pitch: 0.025" (0.64mm) Height Above Board: 0.144" (3.66mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 5mm Number of Rows: 8 |
auf Bestellung 300 Stücke: Lieferzeit 10-14 Tag (e) |
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APM6-100-01.5-L-08-0-A-TR | Samtec |
Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HP High-Performance Array Terminal |
auf Bestellung 270 Stücke: Lieferzeit 10-14 Tag (e) |
|
| APM6-100-01.5-L-08-0-A-TR |
|
Hersteller: Samtec Inc.
Description: 0.635 MM ACCELERATE HP HIGH-PERF
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 800
Pitch: 0.025" (0.64mm)
Height Above Board: 0.144" (3.66mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 5mm
Number of Rows: 8
Description: 0.635 MM ACCELERATE HP HIGH-PERF
Features: Board Guide
Packaging: Cut Tape (CT)
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 800
Pitch: 0.025" (0.64mm)
Height Above Board: 0.144" (3.66mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 5mm
Number of Rows: 8
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 108.59 EUR |
| 10+ | 93.75 EUR |
| APM6-100-01.5-L-08-0-A-TR |
|
Hersteller: Samtec
Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HP High-Performance Array Terminal
Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HP High-Performance Array Terminal
auf Bestellung 270 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 117.53 EUR |
| 10+ | 111.27 EUR |
| 25+ | 107.1 EUR |
| 50+ | 104.47 EUR |
| 100+ | 90.96 EUR |
| 300+ | 79.31 EUR |