Technische Details APTGLQ100H65T3G MICROCHIP TECHNOLOGY
Description: IGBT MODULE 650V 135A 350W SP3F, Packaging: Bulk, Package / Case: Module, Mounting Type: Chassis Mount, Input: Standard, Configuration: Full Bridge, Operating Temperature: -40°C ~ 175°C (TJ), Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 100A, NTC Thermistor: Yes, Supplier Device Package: SP3F, IGBT Type: Trench Field Stop, Current - Collector (Ic) (Max): 135 A, Voltage - Collector Emitter Breakdown (Max): 650 V, Power - Max: 350 W, Current - Collector Cutoff (Max): 50 µA, Input Capacitance (Cies) @ Vce: 6.15 nF @ 25 V.
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APTGLQ100H65T3G | Hersteller : Microchip Technology |
![]() Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Full Bridge Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 100A NTC Thermistor: Yes Supplier Device Package: SP3F IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 135 A Voltage - Collector Emitter Breakdown (Max): 650 V Power - Max: 350 W Current - Collector Cutoff (Max): 50 µA Input Capacitance (Cies) @ Vce: 6.15 nF @ 25 V |
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APTGLQ100H65T3G | Hersteller : Microsemi |
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