APTGT300DH60G Microchip Technology
Hersteller: Microchip TechnologyDescription: IGBT MODULE 600V 430A 1150W SP6
Packaging: Bulk
Package / Case: SP6
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: SP6
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 430 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 1150 W
Current - Collector Cutoff (Max): 350 µA
Input Capacitance (Cies) @ Vce: 24 nF @ 25 V
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details APTGT300DH60G Microchip Technology
Description: IGBT MODULE 600V 430A 1150W SP6, Packaging: Bulk, Package / Case: SP6, Mounting Type: Chassis Mount, Input: Standard, Configuration: Asymmetrical Bridge, Operating Temperature: -40°C ~ 175°C (TJ), Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 300A, NTC Thermistor: No, Supplier Device Package: SP6, IGBT Type: Trench Field Stop, Current - Collector (Ic) (Max): 430 A, Voltage - Collector Emitter Breakdown (Max): 600 V, Power - Max: 1150 W, Current - Collector Cutoff (Max): 350 µA, Input Capacitance (Cies) @ Vce: 24 nF @ 25 V.
Weitere Produktangebote APTGT300DH60G
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| APTGT300DH60G | Hersteller : Microsemi |
IGBT Modules Power Module - IGBT |
Produkt ist nicht verfügbar |