APTGT30H170T3G Microchip Technology
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Technische Details APTGT30H170T3G Microchip Technology
Description: IGBT MODULE 1700V 45A 210W SP3, Packaging: Bulk, Package / Case: SP3, Mounting Type: Chassis Mount, Input: Standard, Configuration: Full Bridge Inverter, Operating Temperature: -40°C ~ 150°C (TJ), Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 30A, NTC Thermistor: Yes, Supplier Device Package: SP3, IGBT Type: Trench Field Stop, Current - Collector (Ic) (Max): 45 A, Voltage - Collector Emitter Breakdown (Max): 1700 V, Power - Max: 210 W, Current - Collector Cutoff (Max): 250 µA, Input Capacitance (Cies) @ Vce: 2.5 nF @ 25 V.
Weitere Produktangebote APTGT30H170T3G
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| APTGT30H170T3G | Hersteller : MICROCHIP (MICROSEMI) |
 Category: IGBT modulesDescription: Module: IGBT; transistor/transistor; H-bridge,NTC thermistor Type of module: IGBT Application: motors Mechanical mounting: screw Pulsed collector current: 70A Max. off-state voltage: 1.7kV Electrical mounting: Press-in PCB Semiconductor structure: transistor/transistor Case: SP3 Gate-emitter voltage: ±20V Collector current: 30A Topology: H-bridge; NTC thermistor Technology: Field Stop; Trench Anzahl je Verpackung: 11 Stücke |
Produkt ist nicht verfügbar |
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| APTGT30H170T3G | Hersteller : Microchip Technology |
Description: IGBT MODULE 1700V 45A 210W SP3 Packaging: Bulk Package / Case: SP3 Mounting Type: Chassis Mount Input: Standard Configuration: Full Bridge Inverter Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 30A NTC Thermistor: Yes Supplier Device Package: SP3 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 45 A Voltage - Collector Emitter Breakdown (Max): 1700 V Power - Max: 210 W Current - Collector Cutoff (Max): 250 µA Input Capacitance (Cies) @ Vce: 2.5 nF @ 25 V |
Produkt ist nicht verfügbar |
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| APTGT30H170T3G | Hersteller : Microsemi |
IGBT Modules Power Module - IGBT |
Produkt ist nicht verfügbar |
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| APTGT30H170T3G | Hersteller : MICROCHIP (MICROSEMI) |
Category: IGBT modules Description: Module: IGBT; transistor/transistor; H-bridge,NTC thermistor Type of module: IGBT Application: motors Mechanical mounting: screw Pulsed collector current: 70A Max. off-state voltage: 1.7kV Electrical mounting: Press-in PCB Semiconductor structure: transistor/transistor Case: SP3 Gate-emitter voltage: ±20V Collector current: 30A Topology: H-bridge; NTC thermistor Technology: Field Stop; Trench |
Produkt ist nicht verfügbar |