Technische Details APTGT600DU60G MICROCHIP TECHNOLOGY
Description: IGBT MODULE 600V 700A 2300W SP6, Packaging: Bulk, Package / Case: SP6, Mounting Type: Chassis Mount, Input: Standard, Configuration: Dual, Common Source, Operating Temperature: -40°C ~ 175°C (TJ), Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A, NTC Thermistor: No, Supplier Device Package: SP6, IGBT Type: Trench Field Stop, Current - Collector (Ic) (Max): 700 A, Voltage - Collector Emitter Breakdown (Max): 600 V, Power - Max: 2300 W, Current - Collector Cutoff (Max): 750 µA, Input Capacitance (Cies) @ Vce: 49 nF @ 25 V.
Weitere Produktangebote APTGT600DU60G
Foto | Bezeichnung | Hersteller | Beschreibung |
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APTGT600DU60G | Hersteller : Microchip Technology |
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Produkt ist nicht verfügbar |
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APTGT600DU60G | Hersteller : MICROSEMI |
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APTGT600DU60G | Hersteller : Microchip Technology |
![]() Packaging: Bulk Package / Case: SP6 Mounting Type: Chassis Mount Input: Standard Configuration: Dual, Common Source Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A NTC Thermistor: No Supplier Device Package: SP6 IGBT Type: Trench Field Stop Current - Collector (Ic) (Max): 700 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 2300 W Current - Collector Cutoff (Max): 750 µA Input Capacitance (Cies) @ Vce: 49 nF @ 25 V |
Produkt ist nicht verfügbar |
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APTGT600DU60G | Hersteller : Microchip Technology |
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Produkt ist nicht verfügbar |