AR 08-HZL-TT Assmann WSW Components
Hersteller: Assmann WSW ComponentsDescription: CONN IC DIP SOCKET 8POS TIN
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Thermoplastic, Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 5230 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 22+ | 0.83 EUR |
| 25+ | 0.73 EUR |
| 27+ | 0.66 EUR |
| 60+ | 0.62 EUR |
| 120+ | 0.6 EUR |
| 300+ | 0.55 EUR |
| 540+ | 0.52 EUR |
| 1020+ | 0.43 EUR |
| 2520+ | 0.39 EUR |
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Technische Details AR 08-HZL-TT Assmann WSW Components
Description: CONN IC DIP SOCKET 8POS TIN, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Thermoplastic, Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote AR 08-HZL-TT
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Preis ohne MwSt |
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AR 08 HZL-TT | Hersteller : Assmann WSW Components |
Description: CONN IC DIP SOCKET 8POS TIN |
auf Bestellung 13819 Stücke: Lieferzeit 10-14 Tag (e) |
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AR08-HZL-TT | Hersteller : Assmann WSW Components | Description: CONN IC DIP SOCKET 8POS TIN |
Produkt ist nicht verfügbar |