Technische Details AR22-HZL-TT Assmann WSW Components
Description: SOCKET, Type: DIP, 0.4" (10.16mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 196.9µin (5.00µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 22 (2 x 11), Operating Temperature: -40°C ~ 105°C.
Weitere Produktangebote AR22-HZL-TT
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| AR 22-HZL-TT | Assmann WSW Components |
Description: SOCKET Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Contact Material - Post: Beryllium Copper Contact Finish Thickness - Post: 196.9µin (5.00µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: FLASH Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -40°C ~ 105°C |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| AR 22-HZL-TT |
Hersteller: Assmann WSW Components
Description: SOCKET
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -40°C ~ 105°C
Description: SOCKET
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 196.9µin (5.00µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -40°C ~ 105°C
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH