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AS4C16M16MSB-6BIN

AS4C16M16MSB-6BIN Alliance Memory, Inc.

AllianceMemory_AS4C16M16MSB-6BIN_256Mb_LPSDR_1.8V_rev1.0_230307_CV.PDF Hersteller: Alliance Memory, Inc.
Description: IC DRAM 256MBIT LVCMOS 54FBGA
Packaging: Tray
Package / Case: 54-TFBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: SDRAM - Mobile SDRAM
Clock Frequency: 166 MHz
Memory Format: DRAM
Supplier Device Package: 54-FBGA (8x8)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: LVCMOS
Access Time: 5.5 ns
Memory Organization: 16M x 16
auf Bestellung 304 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.29 EUR
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40+8.25 EUR
80+8.05 EUR
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Technische Details AS4C16M16MSB-6BIN Alliance Memory, Inc.

Description: IC DRAM 256MBIT LVCMOS 54FBGA, Packaging: Tray, Package / Case: 54-TFBGA, Mounting Type: Surface Mount, Memory Size: 256Mbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 85°C (TA), Voltage - Supply: 1.7V ~ 1.95V, Technology: SDRAM - Mobile SDRAM, Clock Frequency: 166 MHz, Memory Format: DRAM, Supplier Device Package: 54-FBGA (8x8), Part Status: Active, Write Cycle Time - Word, Page: 15ns, Memory Interface: LVCMOS, Access Time: 5.5 ns, Memory Organization: 16M x 16.

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AS4C16M16MSB-6BIN AS4C16M16MSB-6BIN Hersteller : Alliance Memory AllianceMemory_AS4C16M16MSB-6BIN_256Mb_LPSDR_1.8V_rev1.0_230307_CV.PDF DRAM LPSDRAM, 256M, 16M X 16, 1.8V, 54 BALL, BGA, 16 X 16MM, 166MHZ INDUSTRIAL TEMP, B Die
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