AS4C1G32MD4V-046BIN Alliance Memory
Hersteller: Alliance MemoryDRAM LPDDR4X, 32Gb, 1G X 32, 0.6v, 200ball TFBGA, 2133MHZ,industrial Temp
auf Bestellung 181 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 41.96 EUR |
| 10+ | 38.84 EUR |
| 25+ | 36.96 EUR |
| 120+ | 34.6 EUR |
| 240+ | 33.72 EUR |
| 600+ | 33.19 EUR |
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Technische Details AS4C1G32MD4V-046BIN Alliance Memory
Description: IC DRAM 32GBIT LVSTLE 200FBGA, Packaging: Tray, Package / Case: 200-VFBGA, Mounting Type: Surface Mount, Memory Size: 32Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 95°C (TC), Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V, Technology: SDRAM - Mobile LPDDR4X, Clock Frequency: 4.266 GHz, Memory Format: DRAM, Supplier Device Package: 200-FBGA (10x15), Write Cycle Time - Word, Page: 18ns, Memory Interface: LVSTLE_06, Access Time: 3.5 ns, Memory Organization: 1G x 32.
Weitere Produktangebote AS4C1G32MD4V-046BIN nach Preis ab 37.1 EUR bis 42.1 EUR
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| AS4C1G32MD4V-046BIN | Hersteller : Alliance Memory, Inc. |
Description: IC DRAM 32GBIT LVSTLE 200FBGA Packaging: Tray Package / Case: 200-VFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-FBGA (10x15) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTLE_06 Access Time: 3.5 ns Memory Organization: 1G x 32 |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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| AS4C1G32MD4V-046BIN | Hersteller : ALLIANCE MEMORY |
Category: DRAM memories - integrated circuits Description: IC: DRAM memory; 32GbDRAM; FBGA200; -40÷95°C; in-tray Memory: 32Gb DRAM Kind of memory: LPDDR4; SDRAM Operating temperature: -40...95°C Mounting: SMD Case: FBGA200 Type of integrated circuit: DRAM memory Kind of package: in-tray Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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| AS4C1G32MD4V-046BIN | Hersteller : ALLIANCE MEMORY |
Category: DRAM memories - integrated circuits Description: IC: DRAM memory; 32GbDRAM; FBGA200; -40÷95°C; in-tray Memory: 32Gb DRAM Kind of memory: LPDDR4; SDRAM Operating temperature: -40...95°C Mounting: SMD Case: FBGA200 Type of integrated circuit: DRAM memory Kind of package: in-tray |
Produkt ist nicht verfügbar |