
AS4C1G32MD4V-046BIN Alliance Memory

DRAM LPDDR4X, 32Gb, 1G X 32, 0.6v, 200ball TFBGA, 2133MHZ,industrial Temp
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 42.89 EUR |
10+ | 39.09 EUR |
25+ | 36.63 EUR |
50+ | 35.32 EUR |
120+ | 34.09 EUR |
240+ | 32.01 EUR |
600+ | 31.56 EUR |
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Technische Details AS4C1G32MD4V-046BIN Alliance Memory
Description: IC DRAM 32GBIT LVSTLE 200FBGA, Packaging: Tray, Package / Case: 200-VFBGA, Mounting Type: Surface Mount, Memory Size: 32Gbit, Memory Type: Volatile, Operating Temperature: -40°C ~ 95°C (TC), Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V, Technology: SDRAM - Mobile LPDDR4X, Clock Frequency: 4.266 GHz, Memory Format: DRAM, Supplier Device Package: 200-FBGA (10x15), Write Cycle Time - Word, Page: 18ns, Memory Interface: LVSTLE_06, Access Time: 3.5 ns, Memory Organization: 1G x 32.
Weitere Produktangebote AS4C1G32MD4V-046BIN nach Preis ab 37.10 EUR bis 42.10 EUR
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AS4C1G32MD4V-046BIN | Hersteller : Alliance Memory, Inc. |
Description: IC DRAM 32GBIT LVSTLE 200FBGA Packaging: Tray Package / Case: 200-VFBGA Mounting Type: Surface Mount Memory Size: 32Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 4.266 GHz Memory Format: DRAM Supplier Device Package: 200-FBGA (10x15) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTLE_06 Access Time: 3.5 ns Memory Organization: 1G x 32 |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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AS4C1G32MD4V-046BIN | Hersteller : ALLIANCE MEMORY |
Category: DRAM memories - integrated circuits Description: IC: DRAM memory; 32GbDRAM; FBGA200; -40÷95°C; in-tray Type of integrated circuit: DRAM memory Mounting: SMD Case: FBGA200 Operating temperature: -40...95°C Kind of package: in-tray Kind of memory: LPDDR4; SDRAM Memory: 32Gb DRAM Anzahl je Verpackung: 1 Stücke |
Produkt ist nicht verfügbar |
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AS4C1G32MD4V-046BIN | Hersteller : ALLIANCE MEMORY |
Category: DRAM memories - integrated circuits Description: IC: DRAM memory; 32GbDRAM; FBGA200; -40÷95°C; in-tray Type of integrated circuit: DRAM memory Mounting: SMD Case: FBGA200 Operating temperature: -40...95°C Kind of package: in-tray Kind of memory: LPDDR4; SDRAM Memory: 32Gb DRAM |
Produkt ist nicht verfügbar |