ASFC32G31T3-51BINTR Alliance Memory, Inc.
Hersteller: Alliance Memory, Inc.
Description: IC FLASH 256GBIT EMMC 153FBGA
Clock Frequency: 200 MHz
Technology: FLASH - NAND (TLC)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Gbit
Mounting Type: Surface Mount
Package / Case: 153-TFBGA
Packaging: Cut Tape (CT)
Memory Organization: 32G x 8
Memory Interface: eMMC_5.1
Supplier Device Package: 153-FBGA (11.5x13)
Memory Format: FLASH
| Anzahl | Preis |
|---|---|
| 1+ | 19.25 EUR |
| 10+ | 17.87 EUR |
| 25+ | 17.31 EUR |
| 50+ | 16.89 EUR |
| 100+ | 16.48 EUR |
| 250+ | 16.16 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details ASFC32G31T3-51BINTR Alliance Memory, Inc.
Description: IC FLASH 256GBIT EMMC 153FBGA, Packaging: Tape & Reel (TR), Memory Organization: 32G x 8, Memory Interface: eMMC_5.1, Supplier Device Package: 153-FBGA (11.5x13), Memory Format: FLASH, Clock Frequency: 200 MHz, Technology: FLASH - NAND (TLC), Voltage - Supply: 2.7V ~ 3.6V, Operating Temperature: -40°C ~ 85°C (TA), Memory Type: Non-Volatile, Memory Size: 256Gbit, Mounting Type: Surface Mount, Package / Case: 153-TFBGA.
Weitere Produktangebote ASFC32G31T3-51BINTR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
|
ASFC32G31T3-51BINTR | Hersteller : Alliance Memory, Inc. |
Description: IC FLASH 256GBIT EMMC 153FBGA Packaging: Tape & Reel (TR) Memory Organization: 32G x 8 Memory Interface: eMMC_5.1 Supplier Device Package: 153-FBGA (11.5x13) Memory Format: FLASH Clock Frequency: 200 MHz Technology: FLASH - NAND (TLC) Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Memory Type: Non-Volatile Memory Size: 256Gbit Mounting Type: Surface Mount Package / Case: 153-TFBGA |
Produkt ist nicht verfügbar |
|
 |
ASFC32G31T3-51BINTR | Hersteller : Alliance Memory |
eMMC eMMC 32GB, 3V, (TLC Gen3 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Reel |
Produkt ist nicht verfügbar |