ATS-59007-C1-R0 Advanced Thermal Solutions
Hersteller: Advanced Thermal Solutions
Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 35mm Comp, 35x46x16mm
| Anzahl | Privatkunde |
|---|---|
| 1+ | 46.83 EUR |
| 10+ | 41.5 EUR |
| 20+ | 39.54 EUR |
| 50+ | 38.09 EUR |
| 100+ | 36.38 EUR |
| 200+ | 34.62 EUR |
| 500+ | 33.68 EUR |
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10-14 Tag (e)
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Technische Details ATS-59007-C1-R0 Advanced Thermal Solutions
Description: HEAT SINK 35MM X 46MM X 16MM, Material Finish: Black Anodized, Fin Height: 0.630" (16.00mm), Thermal Resistance @ Forced Air Flow: 2.40°C/W @ 200 LFM, Attachment Method: Clip, Package Cooled: Flip Chip Processors, Width: 1.811" (46.00mm), Type: Top Mount, Shape: Rectangular, Angled Fins, Length: 1.378" (35.00mm), Material: Aluminum, Packaging: Bulk.
Weitere Produktangebote ATS-59007-C1-R0
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
ATS-59007-C1-R0 | Advanced Thermal Solutions Inc. |
Description: HEAT SINK 35MM X 46MM X 16MM Material Finish: Black Anodized Fin Height: 0.630" (16.00mm) Thermal Resistance @ Forced Air Flow: 2.40°C/W @ 200 LFM Attachment Method: Clip Package Cooled: Flip Chip Processors Width: 1.811" (46.00mm) Type: Top Mount Shape: Rectangular, Angled Fins Length: 1.378" (35.00mm) Material: Aluminum Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| ATS-59007-C1-R0 | Advanced Thermal Solutions |
Category: Heatsinks Description: Heatsink: attachable; grilled; BGA; black; L: 35mm; W: 68.6mm; H: 16mm Manufacturer series: NXP Application: BGA Width: 68.6mm Heatsink shape: grilled Height: 16mm Material finishing: anodized Colour: black Thermal resistance @200 LFM: 2.4°C/W Type of heatsink: attachable Length: 35mm |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| ATS-59007-C1-R0 |
|
Hersteller: Advanced Thermal Solutions Inc.
Description: HEAT SINK 35MM X 46MM X 16MM
Material Finish: Black Anodized
Fin Height: 0.630" (16.00mm)
Thermal Resistance @ Forced Air Flow: 2.40°C/W @ 200 LFM
Attachment Method: Clip
Package Cooled: Flip Chip Processors
Width: 1.811" (46.00mm)
Type: Top Mount
Shape: Rectangular, Angled Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Bulk
Description: HEAT SINK 35MM X 46MM X 16MM
Material Finish: Black Anodized
Fin Height: 0.630" (16.00mm)
Thermal Resistance @ Forced Air Flow: 2.40°C/W @ 200 LFM
Attachment Method: Clip
Package Cooled: Flip Chip Processors
Width: 1.811" (46.00mm)
Type: Top Mount
Shape: Rectangular, Angled Fins
Length: 1.378" (35.00mm)
Material: Aluminum
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ATS-59007-C1-R0 |
|
Hersteller: Advanced Thermal Solutions
Category: Heatsinks
Description: Heatsink: attachable; grilled; BGA; black; L: 35mm; W: 68.6mm; H: 16mm
Manufacturer series: NXP
Application: BGA
Width: 68.6mm
Heatsink shape: grilled
Height: 16mm
Material finishing: anodized
Colour: black
Thermal resistance @200 LFM: 2.4°C/W
Type of heatsink: attachable
Length: 35mm
Category: Heatsinks
Description: Heatsink: attachable; grilled; BGA; black; L: 35mm; W: 68.6mm; H: 16mm
Manufacturer series: NXP
Application: BGA
Width: 68.6mm
Heatsink shape: grilled
Height: 16mm
Material finishing: anodized
Colour: black
Thermal resistance @200 LFM: 2.4°C/W
Type of heatsink: attachable
Length: 35mm
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH