ATS-KRP-3567-C1-R0 Advanced Thermal Solutions
Hersteller: Advanced Thermal Solutions
Heat Sinks Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, Straight, 54x68x10mm
| Anzahl | Preis |
|---|---|
| 1+ | 47.85 EUR |
| 10+ | 41.24 EUR |
| 20+ | 37.52 EUR |
| 50+ | 34.9 EUR |
| 100+ | 34.09 EUR |
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Technische Details ATS-KRP-3567-C1-R0 Advanced Thermal Solutions
Description: AMD XILINX HEATSINK K26 54X68X10, Packaging: Box, Material: Aluminum, Length: 2.126" (54.00mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 2.677" (68.00mm), Package Cooled: AMD Kria™ K26 SOM, Attachment Method: Screw, Power Dissipation @ Temperature Rise: 15.0W @ 55°C, Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote ATS-KRP-3567-C1-R0 nach Preis ab 32.69 EUR bis 51.11 EUR
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ATS-KRP-3567-C1-R0 | Hersteller : Advanced Thermal Solutions Inc. |
Description: AMD XILINX HEATSINK K26 54X68X10 Packaging: Box Material: Aluminum Length: 2.126" (54.00mm) Shape: Rectangular, Fins Type: Top Mount Width: 2.677" (68.00mm) Package Cooled: AMD Kria™ K26 SOM Attachment Method: Screw Power Dissipation @ Temperature Rise: 15.0W @ 55°C Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM Fin Height: 0.394" (10.00mm) Material Finish: Black Anodized |
auf Bestellung 227 Stücke: Lieferzeit 10-14 Tag (e) |
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