ATS-KRP-3567-C1-R0 Advanced Thermal Solutions Inc.
Hersteller: Advanced Thermal Solutions Inc.
Description: AMD XILINX HEATSINK K26 54X68X10
Packaging: Box
Material: Aluminum
Length: 2.126" (54.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 2.677" (68.00mm)
Package Cooled: AMD Kria™ K26 SOM
Attachment Method: Screw
Power Dissipation @ Temperature Rise: 15.0W @ 55°C
Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM
Fin Height: 0.394" (10.00mm)
Material Finish: Black Anodized
| Anzahl | Preis |
|---|---|
| 1+ | 51.11 EUR |
| 10+ | 41.02 EUR |
| 25+ | 37.33 EUR |
| 50+ | 34.72 EUR |
| 100+ | 32.69 EUR |
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Technische Details ATS-KRP-3567-C1-R0 Advanced Thermal Solutions Inc.
Description: AMD XILINX HEATSINK K26 54X68X10, Packaging: Box, Material: Aluminum, Length: 2.126" (54.00mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 2.677" (68.00mm), Package Cooled: AMD Kria™ K26 SOM, Attachment Method: Screw, Power Dissipation @ Temperature Rise: 15.0W @ 55°C, Thermal Resistance @ Forced Air Flow: 1.20°C/W @ 200 LFM, Fin Height: 0.394" (10.00mm), Material Finish: Black Anodized.
Weitere Produktangebote ATS-KRP-3567-C1-R0
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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ATS-KRP-3567-C1-R0 | Hersteller : Advanced Thermal Solutions |
Heat Sinks Heat Sink for AMD Xilinx Kria K26 SoM Device, Passive, 54x68x10mm |
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