ATS-PCB1073 Advanced Thermal Solutions
Hersteller: Advanced Thermal Solutions
Heat Sinks BGA Heat Sink, High Performance, No TIM, Tin Plate, TO-263, 12.7x26.2x10.2mm
| Anzahl | Preis |
|---|---|
| 2+ | 2.32 EUR |
| 10+ | 2.08 EUR |
| 20+ | 1.99 EUR |
| 50+ | 1.9 EUR |
| 100+ | 1.8 EUR |
| 200+ | 1.76 EUR |
| 500+ | 1.68 EUR |
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Technische Details ATS-PCB1073 Advanced Thermal Solutions
Description: HEATSINK TO-263 COPPER, Packaging: Bulk, Material: Copper, Length: 0.500" (12.70mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 1.031" (26.20mm), Package Cooled: TO-263 (D²Pak), Thermal Resistance @ Forced Air Flow: 9.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 18.00°C/W, Fin Height: 0.402" (10.21mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote ATS-PCB1073 nach Preis ab 1.5 EUR bis 2.34 EUR
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ATS-PCB1073 | Hersteller : Advanced Thermal Solutions Inc. |
Description: HEATSINK TO-263 COPPER Packaging: Bulk Material: Copper Length: 0.500" (12.70mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.031" (26.20mm) Package Cooled: TO-263 (D²Pak) Thermal Resistance @ Forced Air Flow: 9.50°C/W @ 200 LFM Thermal Resistance @ Natural: 18.00°C/W Fin Height: 0.402" (10.21mm) Material Finish: Tin Part Status: Active |
auf Bestellung 115804 Stücke: Lieferzeit 10-14 Tag (e) |
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