B32914A3225M000 TDK
Hersteller: TDK
Description: CAP FILM 2.2UF 20% 760VDC RADIAL
Packaging: Bulk
Tolerance: ±20%
Package / Case: Radial
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 110°C
Applications: EMI, RFI Suppression
Lead Spacing: 1.083" (27.50mm)
Termination: PC Pins
Ratings: X1
Dielectric Material: Polypropylene (PP), Metallized
Voltage Rating - AC: 330V
Voltage Rating - DC: 760V
Height - Seated (Max): 1.181" (30.00mm)
Capacitance: 2.2 µF
Size / Dimension: 1.240" L x 0.748" W (31.50mm x 19.00mm)
| Anzahl | Preis |
|---|---|
| 4+ | 5.26 EUR |
| 10+ | 3.72 EUR |
| 50+ | 3.11 EUR |
| 180+ | 2.79 EUR |
| 540+ | 2.59 EUR |
| 1080+ | 2.49 EUR |
| 2520+ | 2.4 EUR |
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Technische Details B32914A3225M000 TDK
Description: CAP FILM 2.2UF 20% 760VDC RADIAL, Packaging: Bulk, Tolerance: ±20%, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: EMI, RFI Suppression, Lead Spacing: 1.083" (27.50mm), Termination: PC Pins, Ratings: X1, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 330V, Voltage Rating - DC: 760V, Height - Seated (Max): 1.181" (30.00mm), Capacitance: 2.2 µF, Size / Dimension: 1.240" L x 0.748" W (31.50mm x 19.00mm).