B32923H3224M EPCOS / TDK
auf Bestellung 1835 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 1.61 EUR |
| 10+ | 0.84 EUR |
| 100+ | 0.76 EUR |
| 500+ | 0.63 EUR |
| 1000+ | 0.6 EUR |
| 2520+ | 0.56 EUR |
| 5040+ | 0.55 EUR |
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Technische Details B32923H3224M EPCOS / TDK
Description: CAP FILM 0.22UF 20% 630VDC RAD, Packaging: Bulk, Tolerance: ±20%, Features: 85C/85% Humidity, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: Automotive; EMI, RFI Suppression, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Ratings: AEC-Q200, X2, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Height - Seated (Max): 0.630" (16.00mm), Part Status: Active, Capacitance: 0.22 µF, Size / Dimension: 1.043" L x 0.276" W (26.50mm x 7.00mm).
Weitere Produktangebote B32923H3224M nach Preis ab 0.6 EUR bis 1.64 EUR
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B32923H3224M | Hersteller : EPCOS - TDK Electronics |
 Description: CAP FILM 0.22UF 20% 630VDC RADPackaging: Bulk Tolerance: ±20% Features: 85C/85% Humidity Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: Automotive; EMI, RFI Suppression Lead Spacing: 0.886" (22.50mm) Termination: PC Pins Ratings: AEC-Q200, X2 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 305V Voltage Rating - DC: 630V Height - Seated (Max): 0.630" (16.00mm) Part Status: Active Capacitance: 0.22 µF Size / Dimension: 1.043" L x 0.276" W (26.50mm x 7.00mm) |
auf Bestellung 2343 Stücke: Lieferzeit 10-14 Tag (e) |
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