B32923H3225M EPCOS / TDK
auf Bestellung 1531 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 5.09 EUR |
| 10+ | 3.63 EUR |
| 25+ | 3.59 EUR |
| 50+ | 2.90 EUR |
| 100+ | 2.85 EUR |
| 260+ | 2.43 EUR |
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Technische Details B32923H3225M EPCOS / TDK
Description: CAP FILM 2.2UF 20% 630VDC RADIAL, Tolerance: ±20%, Features: 85C/85% Humidity, Packaging: Bulk, Package / Case: Radial, Mounting Type: Through Hole, Operating Temperature: -40°C ~ 110°C, Applications: Automotive; EMI, RFI Suppression, Lead Spacing: 0.886" (22.50mm), Termination: PC Pins, Ratings: AEC-Q200, X2, Dielectric Material: Polypropylene (PP), Metallized, Voltage Rating - AC: 305V, Voltage Rating - DC: 630V, Height - Seated (Max): 1.169" (29.70mm), Part Status: Active, Capacitance: 2.2 µF, Size / Dimension: 1.043" L x 0.571" W (26.50mm x 14.50mm).
Weitere Produktangebote B32923H3225M nach Preis ab 2.34 EUR bis 5.28 EUR
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B32923H3225M | Hersteller : EPCOS - TDK Electronics |
 Description: CAP FILM 2.2UF 20% 630VDC RADIALTolerance: ±20% Features: 85C/85% Humidity Packaging: Bulk Package / Case: Radial Mounting Type: Through Hole Operating Temperature: -40°C ~ 110°C Applications: Automotive; EMI, RFI Suppression Lead Spacing: 0.886" (22.50mm) Termination: PC Pins Ratings: AEC-Q200, X2 Dielectric Material: Polypropylene (PP), Metallized Voltage Rating - AC: 305V Voltage Rating - DC: 630V Height - Seated (Max): 1.169" (29.70mm) Part Status: Active Capacitance: 2.2 µF Size / Dimension: 1.043" L x 0.571" W (26.50mm x 14.50mm) |
auf Bestellung 1864 Stücke: Lieferzeit 10-14 Tag (e) |
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