Technische Details BDL-108-G-E Samtec
Description: CONN HEADER VERT 16POS 2.54MM, Mounting Type: Through Hole, Connector Type: Header, Packaging: Tube, Contact Length - Mating: 0.105" (2.67mm), Row Spacing - Mating: 0.100" (2.54mm), Insulation Material: Polyamide (PA), Nylon, Overall Contact Length: 0.300" (7.62mm), Shrouding: Unshrouded, Insulation Height: 0.070" (1.78mm), Contact Length - Post: 0.125" (3.18mm), Contact Shape: Circular, Part Status: Active, Contact Finish - Post: Gold, Contact Finish Thickness - Mating: 20.0µin (0.51µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Black, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board, Number of Rows: 2, Number of Positions: 16.
Weitere Produktangebote BDL-108-G-E nach Preis ab 12.84 EUR bis 21.47 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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BDL-108-G-E | Samtec Inc. |
 Description: CONN HEADER VERT 16POS 2.54MMMounting Type: Through Hole Connector Type: Header Packaging: Tube Contact Length - Mating: 0.105" (2.67mm) Row Spacing - Mating: 0.100" (2.54mm) Insulation Material: Polyamide (PA), Nylon Overall Contact Length: 0.300" (7.62mm) Shrouding: Unshrouded Insulation Height: 0.070" (1.78mm) Contact Length - Post: 0.125" (3.18mm) Contact Shape: Circular Part Status: Active Contact Finish - Post: Gold Contact Finish Thickness - Mating: 20.0µin (0.51µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Rows: 2 Number of Positions: 16 |
auf Bestellung 318 Stücke: Lieferzeit 10-14 Tag (e) |
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BDL-108-G-E | SAMTEC |
Description: SAMTEC - BDL-108-G-E - Stapelbare Leiterplattensteckverbinder, vertikal, BDL, 16 Kontakt(e), Stiftleiste, 2.54 mm tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte Kontaktanschluss: Durchsteckmontage rohsCompliant: YES Rastermaß: 2.54mm Ausführung: Stiftleiste Anzahl der Kontakte: 16Contacts euEccn: NLR Anzahl der Reihen: 2Rows Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Produktpalette: BDL SVHC: No SVHC (15-Jan-2018) |
auf Bestellung 6 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| BDL-108-G-E |
|
Hersteller: Samtec Inc.
Description: CONN HEADER VERT 16POS 2.54MM
Mounting Type: Through Hole
Connector Type: Header
Packaging: Tube
Contact Length - Mating: 0.105" (2.67mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Polyamide (PA), Nylon
Overall Contact Length: 0.300" (7.62mm)
Shrouding: Unshrouded
Insulation Height: 0.070" (1.78mm)
Contact Length - Post: 0.125" (3.18mm)
Contact Shape: Circular
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Rows: 2
Number of Positions: 16
Description: CONN HEADER VERT 16POS 2.54MM
Mounting Type: Through Hole
Connector Type: Header
Packaging: Tube
Contact Length - Mating: 0.105" (2.67mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Polyamide (PA), Nylon
Overall Contact Length: 0.300" (7.62mm)
Shrouding: Unshrouded
Insulation Height: 0.070" (1.78mm)
Contact Length - Post: 0.125" (3.18mm)
Contact Shape: Circular
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Rows: 2
Number of Positions: 16
auf Bestellung 318 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 21.47 EUR |
| 10+ | 16.49 EUR |
| 100+ | 12.84 EUR |
| BDL-108-G-E |
|
Hersteller: SAMTEC
Description: SAMTEC - BDL-108-G-E - Stapelbare Leiterplattensteckverbinder, vertikal, BDL, 16 Kontakt(e), Stiftleiste, 2.54 mm
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Durchsteckmontage
rohsCompliant: YES
Rastermaß: 2.54mm
Ausführung: Stiftleiste
Anzahl der Kontakte: 16Contacts
euEccn: NLR
Anzahl der Reihen: 2Rows
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: BDL
SVHC: No SVHC (15-Jan-2018)
Description: SAMTEC - BDL-108-G-E - Stapelbare Leiterplattensteckverbinder, vertikal, BDL, 16 Kontakt(e), Stiftleiste, 2.54 mm
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Kontaktanschluss: Durchsteckmontage
rohsCompliant: YES
Rastermaß: 2.54mm
Ausführung: Stiftleiste
Anzahl der Kontakte: 16Contacts
euEccn: NLR
Anzahl der Reihen: 2Rows
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: BDL
SVHC: No SVHC (15-Jan-2018)
auf Bestellung 6 Stücke:
Lieferzeit 14-21 Tag (e)