BGA0035 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: BGA-196 TO PGA-196
Packaging: Bulk
Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 196
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: BGA
Description: BGA-196 TO PGA-196
Packaging: Bulk
Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 196
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: BGA
auf Bestellung 27 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 123.57 EUR |
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Technische Details BGA0035 Chip Quik Inc.
Description: BGA-196 TO PGA-196, Packaging: Bulk, Size / Dimension: 2.300" L x 2.200" W (58.42mm x 55.88mm), Material: FR4 Epoxy Glass, Number of Positions: 196, Pitch: 0.020" (0.50mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to PGA, Package Accepted: BGA.
Weitere Produktangebote BGA0035
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
BGA0035 | Hersteller : Chip Quik | Component Kits BGA-196 to PGA-196 SMT Adapter (0.5mm pitch, 14 x 14 grid) |
Produkt ist nicht verfügbar |