Technische Details BGAH190-090E OHMITE
Description: BGA HEATSINK W/TAPE, Packaging: Box, Material: Aluminum Alloy, Length: 0.748" (19.00mm), Shape: Square, Angled Fins, Type: Top Mount, Width: 0.748" (19.00mm), Package Cooled: BGA, CPU, GPU, Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM, Fin Height: 0.354" (9.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote BGAH190-090E
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BGAH190-090E | Hersteller : Ohmite |
![]() Packaging: Box Material: Aluminum Alloy Length: 0.748" (19.00mm) Shape: Square, Angled Fins Type: Top Mount Width: 0.748" (19.00mm) Package Cooled: BGA, CPU, GPU Attachment Method: Thermal Tape, Adhesive (Included) Thermal Resistance @ Forced Air Flow: 4.50°C/W @ 200 LFM Fin Height: 0.354" (9.00mm) Material Finish: Black Anodized Part Status: Active |
Produkt ist nicht verfügbar |
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BGAH190-090E | Hersteller : Ohmite |
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Produkt ist nicht verfügbar |