BK13C06-50DS/2-0.35V(800) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 0.35MM SMD 50POS
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 50
Pitch: 0.014" (0.35mm)
Height Above Board: 0.022" (0.57mm)
Contact Finish Thickness: 1.97µin (0.050µm)
Mated Stacking Heights: 0.6mm
Number of Rows: 2
auf Bestellung 12649 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 9+ | 2.15 EUR |
| 11+ | 1.74 EUR |
| 25+ | 1.60 EUR |
| 50+ | 1.51 EUR |
| 100+ | 1.42 EUR |
| 250+ | 1.31 EUR |
| 500+ | 1.23 EUR |
| 1000+ | 1.16 EUR |
| 2500+ | 1.07 EUR |
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Technische Details BK13C06-50DS/2-0.35V(800) Hirose Electric Co Ltd
Description: CONN RCPT 0.35MM SMD 50POS, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 50, Pitch: 0.014" (0.35mm), Height Above Board: 0.022" (0.57mm), Contact Finish Thickness: 1.97µin (0.050µm), Mated Stacking Heights: 0.6mm, Number of Rows: 2.
Weitere Produktangebote BK13C06-50DS/2-0.35V(800)
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BK13C06-50DS/2-0.35V(800) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 0.35MM SMD 50POS Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 50 Pitch: 0.014" (0.35mm) Height Above Board: 0.022" (0.57mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.6mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BK13C06-50DS/2-0.35V(800) | Hersteller : Hirose Connector |
FFC & FPC Connectors Low-Profile Hybrid FPC-to-Board Conn |
Produkt ist nicht verfügbar |