(SN).jpg "BM03B-ZESS-TBT(LF)(SN)")
BM03B-ZESS-TBT(LF)(SN) JST Sales America Inc.
Hersteller: JST Sales America Inc.
Description: CONN HEADER SMD 3POS 1.5MM
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.295" (7.50mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Outer Shroud Contact
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Voltage Rating: 100V
Connector Type: Header
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 800+ | 0.71 EUR |
| 1600+ | 0.63 EUR |
| 2400+ | 0.59 EUR |
| 5600+ | 0.57 EUR |
| 8000+ | 0.53 EUR |
| 20000+ | 0.52 EUR |
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Technische Details BM03B-ZESS-TBT(LF)(SN) JST Sales America Inc.
Description: CONN HEADER SMD 3POS 1.5MM, Insulation Material: Polyamide (PA), Nylon, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.295" (7.50mm), Contact Shape: Rectangular, Part Status: Active, Contact Finish - Post: Tin, Contact Finish - Mating: Tin, Pitch - Mating: 0.059" (1.50mm), Insulation Color: Natural, Contact Material: Copper Alloy, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Locking Ramp, Contact Type: Outer Shroud Contact, Operating Temperature: -25°C ~ 85°C, Style: Board to Cable/Wire, Number of Rows: 1, Number of Positions: 3, Mounting Type: Surface Mount, Current Rating (Amps): 2A, Voltage Rating: 100V, Connector Type: Header, Features: Pick and Place, Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM03B-ZESS-TBT(LF)(SN) nach Preis ab 0.42 EUR bis 1.25 EUR
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BM03B-ZESS-TBT(LF)(SN) | JST Sales America Inc. |
Description: CONN HEADER SMD 3POS 1.5MM Insulation Material: Polyamide (PA), Nylon Shrouding: Shrouded - 4 Wall Insulation Height: 0.295" (7.50mm) Contact Shape: Rectangular Part Status: Active Contact Finish - Post: Tin Contact Finish - Mating: Tin Pitch - Mating: 0.059" (1.50mm) Insulation Color: Natural Contact Material: Copper Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Locking Ramp Contact Type: Outer Shroud Contact Operating Temperature: -25°C ~ 85°C Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 3 Mounting Type: Surface Mount Current Rating (Amps): 2A Voltage Rating: 100V Connector Type: Header Features: Pick and Place, Solder Retention Packaging: Cut Tape (CT) |
auf Bestellung 24144 Stücke: Lieferzeit 10-14 Tag (e) |
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BM03B-ZESS-TBT (LF)(SN) | JST / JAPAN SOLDERLESS TERMINALS |
Description: JST / JAPAN SOLDERLESS TERMINALS - BM03B-ZESS-TBT (LF)(SN) - Stiftleiste, Einführung oben, Wire-to-Board, 1.5 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupfer isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 3Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: ZE productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 1Reihe(n) Rastermaß: 1.5mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 409 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||
| BM03B-ZESS-TBT(LF)(SN) | JST Commercial |
Headers & Wire Housings ZE HEADER (SMT TOP) |
auf Bestellung 1145 Stücke: Lieferzeit 10-14 Tag (e) |
|
| BM03B-ZESS-TBT(LF)(SN) |
|
Hersteller: JST Sales America Inc.
Description: CONN HEADER SMD 3POS 1.5MM
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.295" (7.50mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Outer Shroud Contact
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Voltage Rating: 100V
Connector Type: Header
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
Description: CONN HEADER SMD 3POS 1.5MM
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.295" (7.50mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.059" (1.50mm)
Insulation Color: Natural
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Locking Ramp
Contact Type: Outer Shroud Contact
Operating Temperature: -25°C ~ 85°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Current Rating (Amps): 2A
Voltage Rating: 100V
Connector Type: Header
Features: Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
auf Bestellung 24144 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 15+ | 1.25 EUR |
| 17+ | 1.1 EUR |
| 100+ | 0.9 EUR |
| BM03B-ZESS-TBT (LF)(SN) |
|
Hersteller: JST / JAPAN SOLDERLESS TERMINALS
Description: JST / JAPAN SOLDERLESS TERMINALS - BM03B-ZESS-TBT (LF)(SN) - Stiftleiste, Einführung oben, Wire-to-Board, 1.5 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupfer
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 3Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: ZE
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.5mm
SVHC: No SVHC (21-Jan-2025)
Description: JST / JAPAN SOLDERLESS TERMINALS - BM03B-ZESS-TBT (LF)(SN) - Stiftleiste, Einführung oben, Wire-to-Board, 1.5 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupfer
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 3Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: ZE
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 1.5mm
SVHC: No SVHC (21-Jan-2025)
auf Bestellung 409 Stücke:
Lieferzeit 14-21 Tag (e)Im Einkaufswagen Stück im Wert von UAH
| BM03B-ZESS-TBT(LF)(SN) |
|
Hersteller: JST Commercial
Headers & Wire Housings ZE HEADER (SMT TOP)
Headers & Wire Housings ZE HEADER (SMT TOP)
auf Bestellung 1145 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 0.89 EUR |
| 10+ | 0.76 EUR |
| 100+ | 0.64 EUR |
| 800+ | 0.44 EUR |
| 4000+ | 0.42 EUR |