BM10B(0.8)-16DP-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN HDR 16POS SMD GOLD
Features: Solder Retention
Packaging: Cut Tape (CT)
Connector Type: Header, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Height Above Board: 0.025" (0.63mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Part Status: Active
Number of Rows: 2
auf Bestellung 5014 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 19+ | 0.93 EUR |
| 23+ | 0.77 EUR |
| 25+ | 0.71 EUR |
| 50+ | 0.67 EUR |
| 100+ | 0.63 EUR |
| 250+ | 0.58 EUR |
| 500+ | 0.55 EUR |
| 1000+ | 0.51 EUR |
| 2500+ | 0.47 EUR |
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Technische Details BM10B(0.8)-16DP-0.4V(51) Hirose Electric Co Ltd
Description: CONN HDR 16POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Header, Outer Shroud Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 16, Pitch: 0.016" (0.40mm), Height Above Board: 0.025" (0.63mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM10B(0.8)-16DP-0.4V(51)
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BM10B(0.8)-16DP-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN HDR 16POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 16 Pitch: 0.016" (0.40mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |
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BM10B(0.8)-16DP-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 16P HDR 0.8 HGHT |
Produkt ist nicht verfügbar |