BM10JC-20DS-0.4V(53) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 20POS SMD GOLD
Number of Rows: 2
Part Status: Last Time Buy
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 20
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Tape & Reel (TR)
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Technische Details BM10JC-20DS-0.4V(53) Hirose Electric Co Ltd
Description: CONN RCPT 20POS SMD GOLD, Number of Rows: 2, Part Status: Last Time Buy, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 2.00µin (0.051µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.016" (0.40mm), Number of Positions: 20, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM10JC-20DS-0.4V(53)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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BM10JC-20DS-0.4V(53) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 20P 2 ROW RECEPT SMT VERT .4MM PITCH |
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