BM10NB(0.8)-30DS-0.4V(75) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 30POS SMD GOLD
Packaging: Tape & Reel (TR)
Features: Solder Retention
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 4.00µin (0.100µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
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Technische Details BM10NB(0.8)-30DS-0.4V(75) Hirose Electric Co Ltd
Description: CONN RCPT 30POS SMD GOLD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM10NB(0.8)-30DS-0.4V(75)
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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BM10NB(0.8)-30DS-0.4V(75) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 30P RECP 0.8 HGHT |
Produkt ist nicht verfügbar |