BM10NB(0.8)-40DS-0.4V(51) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co LtdDescription: CONN RCPT 40POS SMD GOLD
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle, Center Strip Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.016" (0.40mm)
Height Above Board: 0.031" (0.80mm)
Contact Finish Thickness: 2.00µin (0.051µm)
Mated Stacking Heights: 0.8mm
Number of Rows: 2
auf Bestellung 56000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 8000+ | 0.98 EUR |
| 16000+ | 0.93 EUR |
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Technische Details BM10NB(0.8)-40DS-0.4V(51) Hirose Electric Co Ltd
Description: CONN RCPT 40POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 40, Pitch: 0.016" (0.40mm), Height Above Board: 0.031" (0.80mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Number of Rows: 2.
Weitere Produktangebote BM10NB(0.8)-40DS-0.4V(51) nach Preis ab 0.87 EUR bis 1.85 EUR
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BM10NB(0.8)-40DS-0.4V(51) | Hersteller : Hirose Connector |
Board to Board & Mezzanine Connectors 0.4MM FPC TO BOARD 40P RECP 0.8 HGHT |
auf Bestellung 13551 Stücke: Lieferzeit 10-14 Tag (e) |
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BM10NB(0.8)-40DS-0.4V(51) | Hersteller : Hirose Electric Co Ltd |
Description: CONN RCPT 40POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.016" (0.40mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 |
auf Bestellung 72214 Stücke: Lieferzeit 10-14 Tag (e) |
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