BM14B(0.8)-10DS-0.4V(53) Hirose Electric Co Ltd
Hersteller: Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD
Number of Rows: 2
Part Status: Active
Mated Stacking Heights: 0.8mm
Contact Finish Thickness: 2.00µin (0.051µm)
Height Above Board: 0.031" (0.80mm)
Pitch: 0.016" (0.40mm)
Number of Positions: 10
Mounting Type: Surface Mount
Contact Finish: Gold
Connector Type: Receptacle, Center Strip Contacts
Features: Solder Retention
Packaging: Cut Tape (CT)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.05 EUR |
| 13+ | 1.75 EUR |
| 25+ | 1.68 EUR |
| 50+ | 1.64 EUR |
| 100+ | 1.57 EUR |
| 250+ | 1.43 EUR |
| 500+ | 1.29 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details BM14B(0.8)-10DS-0.4V(53) Hirose Electric Co Ltd
Description: CONN RCPT 10POS SMD GOLD, Number of Rows: 2, Part Status: Active, Mated Stacking Heights: 0.8mm, Contact Finish Thickness: 2.00µin (0.051µm), Height Above Board: 0.031" (0.80mm), Pitch: 0.016" (0.40mm), Number of Positions: 10, Mounting Type: Surface Mount, Contact Finish: Gold, Connector Type: Receptacle, Center Strip Contacts, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote BM14B(0.8)-10DS-0.4V(53) nach Preis ab 1.13 EUR bis 2.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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BM14B(0.8)-10DS-0.4V(53) | Hirose Connector |
Board to Board & Mezzanine Connectors 10P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM |
auf Bestellung 734 Stücke: Lieferzeit 10-14 Tag (e) |
|
| BM14B(0.8)-10DS-0.4V(53) |
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Hersteller: Hirose Connector
Board to Board & Mezzanine Connectors 10P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM
Board to Board & Mezzanine Connectors 10P DR RCP B2B/B2FPC 0.8mm H 0.4mm P VSM
auf Bestellung 734 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.12 EUR |
| 10+ | 1.78 EUR |
| 25+ | 1.71 EUR |
| 100+ | 1.61 EUR |
| 250+ | 1.45 EUR |
| 500+ | 1.33 EUR |
| 1000+ | 1.13 EUR |

