BM15FR0.8-20DP-0.35V(53) Hirose Connector
auf Bestellung 80 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
3+ | 1.00 EUR |
10+ | 0.87 EUR |
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Technische Details BM15FR0.8-20DP-0.35V(53) Hirose Connector
Description: CONN PLUG 20POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Plug, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 20, Pitch: 0.014" (0.35mm), Height Above Board: 0.024" (0.61mm), Contact Finish Thickness: 2.00µin (0.051µm), Mated Stacking Heights: 0.8mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote BM15FR0.8-20DP-0.35V(53) nach Preis ab 0.80 EUR bis 1.00 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
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BM15FR0.8-20DP-0.35V(53) | Hersteller : Hirose Electric Co Ltd |
![]() Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Plug, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.014" (0.35mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
auf Bestellung 488 Stücke: Lieferzeit 10-14 Tag (e) |
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BM15FR0.8-20DP-0.35V(53) | Hersteller : HIROSE |
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Produkt ist nicht verfügbar |
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![]() |
BM15FR0.8-20DP-0.35V(53) | Hersteller : Hirose Electric Co Ltd |
![]() Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Plug, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.014" (0.35mm) Height Above Board: 0.024" (0.61mm) Contact Finish Thickness: 2.00µin (0.051µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 |
Produkt ist nicht verfügbar |